Multithickness layered electronic-photonic devices
View Patent ↗An apparatus comprising an electronic-photonic device. The device includes a planar substrate having a top layer on a middle layer, active electronic components and active photonic waveguide components. The active electronic components are located on first lateral regions of the top layer, and the active photonic waveguide components are located on second lateral regions of the top layer. The second-region thickness is greater than the first-region thickness. The top layer has a higher refractive index than the middle layer.
1. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein one or more of said active electronic components include said top layer as a structural component.
2. The method of claim 1 , wherein said substrate includes a silicon-on-insulator substrate, and, said top layer is a silicon layer located on said middle layer that is a silicon oxide layer.
3. The method of claim 1 , wherein forming said active electronic components includes forming MOS transistors, wherein carrier structures of said transistors are located in said first lateral region.
4. The method of claim 1 , wherein forming said active photonic waveguide components includes forming light-guiding structures in said second lateral region.
5. The method of claim 1 , wherein said electronic-photonic device is part of a telecommunication transceiver in said apparatus configured as a telecommunications system.
6. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said substrate includes a silicon-on-insulator substrate, and, said top layer is a silicon layer located on said middle layer that is a silicon oxide layer, and wherein forming said first lateral regions and said second lateral regions includes:
covering said first lateral region with a material layer;
selectively growing a silicon layer on said second lateral region; and
removing said material layer.
7. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said substrate includes a silicon-on-insulator substrate, and, said top layer is a silicon layer located on said middle layer that is a silicon oxide layer, and wherein forming said first lateral regions and said second lateral regions includes:
selectively implanting oxygen atoms into said first lateral region of said top silicon layer; and
thermally annealing said top silicon layer to form an implanted silicon oxide region in said top silicon layer.
8. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said substrate includes a silicon-on-insulator substrate, and, said top layer is a silicon layer located on said middle layer that is a silicon oxide layer, and wherein forming said first lateral regions and said second lateral regions includes:
forming oxygen barrier layers to cover said top silicon layer corresponding to said second lateral regions;
oxidizing an uncovered portion of said top silicon layer corresponding to said first lateral regions to form silicon oxide layers; and
removing said barrier layer and said silicon oxide layer.
9. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said at least some of said active electronic components are electrically coupled to at least some of said active photonic waveguide components.
10. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said substrate includes a silicon-on-insulator substrate, and, said top layer is a silicon layer located on said middle layer that is a silicon oxide layer, and wherein forming said first lateral regions and said second lateral regions includes:
oxidizing an uppermost portion of said top silicon layer in both of said first lateral regions and said second lateral regions to form a first silicon oxide layer on said silicon layer;
removing said first silicon oxide layer located directly over said first lateral regions to expose portions of said top silicon layer there-under;
oxidizing a topmost part of said exposed portions to form a second silicon oxide layer; and
removing said first and second silicon oxide layers.
11. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and wherein said top layer includes one or more of a well region, source region, drain region or channel region of said active electronic components.
12. A method for manufacturing an apparatus, comprising:
fabricating an electronic-photonic device, including:
providing a planar substrate having a top layer on a middle layer, wherein said top layer has a higher refractive index than said middle layer;
forming first lateral regions and second lateral regions from said top layer such that a first-region thickness of said first lateral regions is less than a second region-thickness of said second lateral regions;
forming active electronic components on said first lateral regions; and
forming active photonic waveguide components on said second lateral regions, and further including a transition region between said first-region thickness and said second-region thickness, wherein said transition region has a gradual increase in thickness from said first lateral region to said second lateral region.