Thermal control of optical filter with local silicon frame

1. A method, comprising:

forming two or more frames from a first wafer;

forming two or more etalons from a second wafer;

disposing a resistive thermal device on each of the two or more frames;

dicing the first wafer and the second wafer; and

bonding each of the frames to a corresponding one of the etalons to form optical subassemblies of optical filters.

2. The method of claim 1 , wherein the frames have different outside dimensions than the etalons.

3. The method of claim 2 , wherein the frames have at least one larger outside dimension than the etalons.

4. The method of claim 1 , wherein the first wafer comprises a thermally conductive material and the second wafer comprises a wafer of etalons.

5. The method of claim 4 , wherein the thermally conductive material comprises silicon (Si), tungsten copper (WCu), or silicon carbide (SiC).

6. The method of claim 4 , wherein said forming comprises a dry etch process or a wet etch process, or combinations thereof, to define the two or more frames on the first wafer.

7. The method of claim 1 , further comprising bonding one of the optical filters onto a micro hot plate.

8. The method of claim 1 , further comprising disposing a heater on each of the two or more frames.

9. The method of claim 1 , wherein said forming comprises forming generally L-shaped frames.

10. The method of claim 9 , wherein the generally L-shaped frames each include a fillet having at least one of right angled surfaces, planar surfaces, beveled surfaces, trapezoidal surfaces, or a circular surface.

11. The method of claim 1 , wherein said forming two or more frames comprises forming generally square shaped frames each having a substantially circular opening.

12. The method of claim 11 , wherein each of the resistive thermal devices is disposed along a circumference of the substantially circular opening of each of the generally square shaped frames.