Semiconductor device and manufacturing method thereof
According to one embodiment, a semiconductor device includes a semiconductor region, a tunnel insulating film provided on the semiconductor region, a charge storage insulating film provided on the tunnel insulating film and having a hafnium oxide including a cubic region, a block insulating film provided on the charge storage insulating film, and a control gate electrode provided on the block insulating film.
1. A semiconductor device comprising:
a semiconductor region;
a tunnel insulating film provided on the semiconductor region;
a charge storage insulating film provided on the tunnel insulating film and having a hafnium oxide including a cubic region;
a block insulating film provided on the charge storage insulating film; and
a control gate electrode provided on the block insulating film,
wherein a ratio of the total number of atoms of hafnium and oxygen in the charge storage insulating film is higher than 99 atomic percent.
2. The device according to claim 1 , wherein the charge storage insulating film has an oxygen vacancy.
3. The device according to claim 1 , wherein the charge storage insulating film contains zirconium.
4. The device according to claim 3 , wherein a ratio of the total number of atoms of hafnium, zirconium, and oxygen in the charge storage insulating film is higher than 99 atomic percent.
5. The device according to claim 1 , wherein the block insulating film is formed of an oxide film.
6. The device according to claim 1 , wherein the semiconductor region is a semiconductor substrate, and the tunnel insulating film, the charge storage insulating film, the block insulating film, and the control gate electrode are stacked on the semiconductor substrate.
7. The device according to claim 1 , wherein the semiconductor region is columnar, and the tunnel insulating film, the charge storage insulating film, the block insulating film, and the control gate electrode surround a side surface of the semiconductor region.
8. The device according to claim 1 , wherein the hafnium oxide includes a monoclinic region.
9. A semiconductor device comprising:
a semiconductor region;
a tunnel insulating film provided on the semiconductor region;
a charge storage insulating film provided on the tunnel insulating film and having a hafnium oxide including a cubic region;
a block insulating film provided on the charge storage insulating film; and
a control gate electrode provided on the block insulating film,
wherein the hafnium oxide contains silicon.
10. The device according to claim 9 , wherein the semiconductor region is columnar, and the tunnel insulating film, the charge storage insulating film, the block insulating film, and the control gate electrode surround a side surface of the semiconductor region.
11. The device according to claim 9 , wherein the hafnium oxide includes a monoclinic region.
12. The device according to claim 9 , wherein the charge storage insulating film contains zirconium.
13. The device according to claim 9 , wherein the block insulating film is formed of an oxide film.
14. The device according to claim 9 , wherein the semiconductor region is a semiconductor substrate, and the tunnel insulating film, the charge storage insulating film, the block insulating film, and the control gate electrode are stacked on the semiconductor substrate.
15. A method for manufacturing a semiconductor device comprising:
a semiconductor region;
a tunnel insulating film provided on the semiconductor region;
a charge storage insulating film provided on the tunnel insulating film;
a block insulating film provided on the charge storage insulating film; and
a control gate electrode provided on the block insulating film,
wherein forming the charge storage insulating film comprises forming a hafnium oxide including a cubic region, and
wherein forming the charge storage insulating film further comprises:
forming a preliminary hafnium oxide film formed of an amorphous film and used for the charge storage insulating film, and
converting the preliminary hafnium oxide film to a hafnium oxide film including a cubic region by a thermal treatment after forming the block insulating film, and
wherein a ratio of the total number of atoms of hafnium and oxygen in the charge storage insulating film is higher than 99 atomic percent.
16. A method for manufacturing a semiconductor device comprising:
a semiconductor region;
a tunnel insulating film provided on the semiconductor region;
a charge storage insulating film provided on the tunnel insulating film;
a block insulating film provided on the charge storage insulating film; and
a control gate electrode provided on the block insulating film,
wherein forming the charge storage insulating film comprises forming a hafnium oxide including a cubic region, and
wherein forming the charge storage insulating film further comprises:
forming a stacked film of a first film containing silicon and oxygen and a second film containing hafnium and oxygen, and
converting the stacked film to a hafnium oxide film including a cubic region by a thermal treatment, wherein the hafnium oxide film contains silicon.
17. The method according to claim 16 , wherein the charge storage insulating film is formed by CVD.