Large area hermetic encapsulation of an optoelectronic device using vacuum lamination

1. A method, comprising:

temporarily affixing an optoelectronic device to a placement head using a first vacuum that is pulled through the placement head, wherein the placement head can move from a first convex shape to a second flat shape;

placing the optoelectronic device with the placement head onto a front sheet, the front sheet being positioned on a flat surface of a platen; and

applying a compressive force to a diaphragm to couple a backsheet with the front sheet and the optoelectronic device.

2. The method of claim 1 , wherein the optoelectronic device is one of an OLED and a photovoltaic device.

3. A method, comprising:

receiving an optoelectronic device at a first assembly;

receiving a sheet of encapsulating material on a platen of a second assembly, the platen having a flat surface and being positioned proximate the first assembly; and

pressing a convex placement head against the optoelectronic device without gas bubble entrapment.

4. The method of claim 3 , further comprising:

pressing a shroud that surrounds the convex placement head against the platen of the second assembly,

wherein the convex placement head has a first limit of travel and wherein the shroud has a second limit of travel that is different so that the optoelectronic device can be picked and placed using lost motion.

5. The method of claim 3 , further comprising:

applying vacuum pressure through the placement head to removably couple the optoelectronic device with a surface of the placement head.

6. The method of claim 5 , further comprising:

bending the surface of the placement head and optoelectronic device removably coupled therewith in a convex curve.

7. The method of claim 6 , further comprising:

moving a pick and place assembly of the first assembly to mate with the second assembly; and

applying vacuum pressure to one or more chambers, including within a shroud of the pick and place assembly.

8. The method of claim 7 , further comprising:

heating the platen.

9. The method of claim 7 , further comprising:

pressing the placement head and the optoelectronic device from a center thereof onto the sheet of encapsulating material to flatten and attach the optoelectronic device thereto.

10. The method of claim 9 , further comprising:

applying pressure to a chamber beneath the platen to counter-balance a compressive force applied to the platen.

11. The method of claim 7 , wherein the vacuum pressure is applied to the one or more chambers before lamination.

12. The method of claim 3 , wherein the optoelectronic device is one of an OLED and a photovoltaic device.

13. The method of claim 3 , wherein the sheet of encapsulating material is one of a front sheet and a back sheet.