Apparatus and method for large area hermetic encapsulation of one or more organic light emitting diodes (OLEDs)
View Patent ↗Apparatus and method for hermetically encapsulating one or more optoelectronic device, such as a light emitting device or a photovoltaic device. The apparatus comprises a base and a carriage movable along the base. The carriage comprises a roller. The apparatus further comprises a vacuum platen coupled with the base and a tensioner coupled with the base. The tensioner comprises a support member that projects orthogonally above a plane of the vacuum platen.
1. A method, comprising:
applying force from a roller to two sheets of encapsulating material(s), a first sheet tensioned to be substantially flat and a second sheet positioned at a predetermined angle relative to the first sheet; and
moving the roller to hermetically encapsulate an optoelectronic device between the first sheet and the second sheet;
the method further comprising:
heating a platen, the platen having a flat surface with one or more holes therein; and
moving the platen from a first position away from the first sheet of encapsulating material to a second position proximate the first sheet of encapsulating material.
2. The method of claim 1 , further comprising:
applying vacuum pressure through the platen to smooth the first sheet of encapsulating material against the flat surface of the platen.
3. The method of claim 1 , further comprising:
applying vacuum pressure through holes in a tensioned non-stick sheet positioned adjacent the platen to smooth the first sheet of encapsulating material against the tensioned non-stick sheet and the flat surface of the platen.
4. The method of claim 1 , wherein the two sheets of encapsulating material(s) are a front sheet and a back sheet, and the optoelectronic device is selected from one of an OLED and a photovoltaic device.
5. A method, comprising:
applying force from a roller to two sheets of encapsulating material, a first sheet tensioned to be substantially flat and a second sheet positioned at a predetermined angle relative to the first sheet; and
moving the roller to hermetically encapsulate an optoelectronic device between the first sheet and the second sheet;
wherein the method further comprises:
moving a platen having a flat surface with one or more holes therein, from a first position away from the first sheet of encapsulating material to a second position proximate the first sheet of encapsulating material.
6. The method of claim 5 , further comprising: heating the platen.
7. A method, comprising:
applying force from a roller to two sheets of encapsulating material, a first sheet tensioned to be substantially flat and a second sheet positioned at a predetermined angle relative to the first sheet; and
moving the roller to hermetically encapsulate an optoelectronic device between the first sheet and the second sheet;
wherein the method further comprises:
moving a platen having a flat surface with one or more holes therein, from a first position away from the first sheet of encapsulating material to a second position proximate the first sheet of encapsulating material; and
applying vacuum pressure through the platen to smooth the first sheet of encapsulating material against the flat surface of the platen.
8. The method of claim 7 , further comprising: heating the platen.