IP Library Granted Patent US 8,734,703
Granted Patent B2
US 8,734,703 · App. 13/238,775 · Granted May 27, 2014

Methods and systems for fabricating composite parts using a SMP apparatus as a rigid lay-up tool and bladder

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Quick Facts
Patent No.
US 8,734,703
App. No.
13/238,775
Granted
May 27, 2014
Kind
B2
Abstract

A method and apparatus for fabricating a composite part with a shape memory polymer (SMP) apparatus usable as both a rigid lay-up tool and as a bladder. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. The composite material may be applied onto the SMP apparatus in the rigid tool configuration and then placed into a rigid external tool and heated to composite cure temperatures at which the SMP apparatus is malleable. A pressure differential may be induced which urges the SMP apparatus to compress the composite material against the rigid external tool. When the composite material is cured, the SMP apparatus may be urged away from the cure composite material and removed from within the composite part.

Claims (26)

1. A method of fabricating a composite part, the method comprising:

applying composite material to at least a portion of a shape memory polymer (SMP) apparatus;

triggering a change in modulus of the SMP apparatus such that the SMP apparatus changes from a rigid state to a malleable state, wherein the change in modulus is triggered by applying at least one of temperature change, an electric current, water, and light to the SMP apparatus;

heating the composite material to a composite material cure temperature; and

inducing a pressure differential that drives the SMP apparatus, in its malleable state, toward the composite material during cure to compress the composite material against a rigid surface.

2. The method of claim 1 , further comprising the steps of:

equalizing the pressure differential after the composite material is cured or inducing a pressure differential sufficient to urge the SMP apparatus away from the cured composite material; and

removing the SMP apparatus from the cured composite material.

3. The method of claim 1 , wherein the step of inducing a pressure differential comprises applying pressure in a range of 1-150 psig to the SMP apparatus to press it toward the rigid surface.

4. The method of claim 1 , further comprising shaping the SMP apparatus into a desired rigid tool configuration while the SMP apparatus is in its malleable state and triggering the SMP apparatus to change back to its rigid state in the desired rigid tool configuration prior to applying composite material to the SMP apparatus.

5. The method of claim 1 , wherein heating the composite material and triggering the change in modulus is performed simultaneously by heating the composite material and SMP apparatus to a cure temperature equal to or greater than T g , wherein the SMP apparatus is configured to begin to change to its malleable state at T g .

6. The method of claim 5 , wherein T g is between 100° F. and 200° F.

7. The method of claim 5 , wherein T g is between 200° F. and 400° F.

8. A method of fabricating a composite part, the method comprising:

applying composite material onto a shape memory polymer (SMP) apparatus in a rigid tool configuration;

placing the composite material and the SMP apparatus within or proximate to a rigid external tool configured to define a surface of the composite part;

heating the composite material and SMP apparatus to a composite material cure temperature above a temperature T g at which the SMP apparatus begins to become malleable; and

inducing a pressure differential sufficient to drive the SMP apparatus toward the composite material before and/or during cure to compress the composite material against the rigid external tool.

9. The method of claim 8 , further comprising the steps of:

equalizing the pressure differential after the composite material is cured or inducing a pressure differential to urge the SMP apparatus away from the cured composite material; and

removing the SMP apparatus from within the cured composite material.

10. The method of claim 8 , wherein T g is between 100° F. and 200° F.

11. The method of claim 8 , wherein T g is between 200° F. and 300° F.

12. The method of claim 8 , wherein T g is between 300° F. and 400° F.

13. The method of claim 8 , wherein the step of inflating the SMP apparatus comprises applying pressure in a range of 1-150 psig to the SMP apparatus.

14. The method of claim 8 , further comprising forming the SMP apparatus into the rigid tool configuration prior to applying composite material to the SMP apparatus by heating the SMP apparatus to a temperature above T 9 , inflating the SMP apparatus within a mold, cooling the SMP apparatus to a temperature below T g , and then removing the SMP apparatus from the mold.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Dec 11, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073932/0669 →
RELEASE OF SECURITY INTEREST Recorded Dec 10, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073900/0356 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065772/0456 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
RELEASE OF SECURITY INTEREST Recorded Nov 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 061995/0281 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2020
From: BANK OF AMERICA, N.A.
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 054230/0578 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053983/0350 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053993/0505 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053993/0569 →
SECURITY INTEREST Recorded Apr 17, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 052433/0843 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 24, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 052004/0929 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 2, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 038592/0181 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Apr 19, 2012
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 028072/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2011
From: HAVENS, DAVID E.; EVERHART, MATTHEW C.; MARGRAF, THOMAS WOOD; EVERHART, JOEL JAMES; KYSAR, RANDY REX; FIEGENBAUM, CARL RAY; PRIEST, JEFFREY W.; STRELOW, DELBERT LEON; PICKELL, KRISTIN DRU
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 026943/0063 →