Organic light-emitting display apparatus and method of manufacturing the same

1. An organic light-emitting display apparatus, comprising:

a planarization layer covering a plurality of thin film transistors formed on a substrate;

a plurality of pixel electrodes, each comprising a light emission portion and a non-light emission portion, wherein the light emission portions ref the pixel electrodes are arranged on the planarization layer in a first grid pattern;

a plurality of via-holes arranged in a second grid pattern which is offset from the first grid pattern, each via-hole connecting a respective one of the plurality of thin film transistors and a respective one of the plurality of pixel electrodes through the planarization layer;

a plurality of dummy via-holes respectively spaced apart from the plurality of via-holes;

a pixel-defining layer (PDL) formed on the planarization layer so as to cover the via-holes, the dummy via-holes, and the non-light emission portion of the pixel electrodes;

an organic layer disposed on the light emission portion and including an emissive layer; and

an opposite electrode disposed on the organic layer.

2. The organic light-emitting display apparatus of claim 1 , wherein the dummy via-holes are disposed outside an area where the pixel electrodes are formed.

3. The organic light-emitting display apparatus of claim 1 , wherein the dummy via-holes are arranged in a third grid pattern which is offset from the first grid pattern.

4. The organic light-emitting display apparatus of chair 3 , wherein a first axis of the third grid pattern and a first axis of the second grid pattern are formed on a same axis, and a second axis of the third grid pattern and a second axis of the second grid pattern are offset.

5. The organic light-emitting display apparatus of claim 1 , wherein the dummy via-holes can comprise a groove portion which is etched in the planarization layer.

6. The organic light-emitting display apparatus of claim 1 , wherein the via-holes are disposed in the non-light emission portion of the pixel electrodes.

7. The organic light emitting display apparatus of claim 6 , wherein a height, with respect to the substrate, of a surface of the pixel-defining layer formed on the via-holes is lower than a height, with respect to the substrate, of a surface of the pixel electrodes formed in the light emission portion.

8. The organic light-emitting display apparatus of claim 1 , wherein the pixel-defining layer comprises an organic insulation material.

9. The organic light-emitting display apparatus of claim 1 , wherein a thickness of the pixel-defining layer is in a range of 500 Å to 2000 Å.

10. The organic light-emitting display apparatus of claim 1 , wherein the pixel-defining layer is substantially planar except in an area covering the via-holes and the dummy via-holes.

11. The organic light-emitting display apparatus of claim 1 , wherein respective distances between the light emission portion and the via-holes, and between the light emission portion and the dummy via-holes which are most adjacent to the light emission portion, are substantially the same.

12. An organic light-emitting display apparatus, comprising:

a planarization layer covering a plurality of thin film transistors;

a plurality of via-holes comprising a groove portion which is formed by etching the planarization layer and a plurality of dummy via-holes which are spaced apart from the via-holes;

a plurality of pixel electrodes, each comprising a light emission portion and a non-light emission portion, wherein the pixel electrodes are connected to one of the plurality of thin film transistors via the via-holes, and a via-hole area including a pair of via-hole and a dummy via-hole which are closest to each other is disposed at a distance furthest away from the light emission portion of each of the plurality of pixel electrodes which are adjacent to the via-hole area;

a pixel-defining layer formed on the planarization layer so as to cover the via-holes, the dummy via-holes, and the non-light emission portion of the pixel electrodes;

an organic layer disposed on the light emission portion and comprising an emissive layer; and

an opposite electrode disposed on the organic layer.

13. The organic light-emitting display apparatus of claim 12 , wherein the light emission portions of the pixel electrodes are arranged in a first grid pattern on the planarization layer, and the via-hole area has an arrangement which is offset from the first grid pattern.

14. The organic light-emitting display apparatus of claim 12 , wherein the via-hole area is disposed between the light emission portions which are diagonally adjacent to one another.

15. The organic light-emitting display apparatus of claim 14 , wherein a center of the via-hole area is disposed at a point of intersection between the diagonally adjacent light emission portions.

16. The organic light-emitting display apparatus of claim 12 , wherein the via-holes are disposed in the non-light emission portions of the pixel electrodes, and the dummy via-holes are disposed outside an area where the pixel electrodes are disposed.

17. A method of manufacturing an organic light-emitting display apparatus, the method comprising the steps of:

preparing an acceptor substrate on which a planarization layer covering a plurality of thin film transistors is disposed;

providing a plurality of pixel electrodes, each comprising a light emission portion and a non-light emission portion, wherein the light emission portions of the pixel electrodes are arranged on the planarization layer in a first grid pattern;

providing a plurality of via-holes, each connecting one of the plurality of thin film transistors and one of the plurality of pixel electrodes through the planarization layer, the via-holes being arranged in a second grid pattern which is offset from the first grid pattern;

providing a plurality of dummy via-holes which are respectively spaced apart from the plurality of via-holes;

providing a pixel-defining layer (PDL) formed on the planarization layer so as to cover the via-holes, the dummy via-holes, and the non-light emission portion of the pixel electrodes;

preparing a donor film on which a transfer layer is formed;

aligning the transfer layer of the donor film and the light emission portion of the acceptor substrate so as to face each other; and

transferring the transfer layer to the light emission portion by irradiating a laser onto the donor film.

18. The method of claim 17 , wherein the donor film further comprises a light-to-heat-conversion (LTHC) layer.

19. The method of claim 17 , wherein the transfer layer comprises at least one layer selected from the group consisting of an organic emissive layer, an organic hole injection layer (HIL), an organic hole injection layer (HIL), an organic electron transport layer (ETL), and an organic electron injection layer (EIL).

20. The method of claim 19 , wherein said at least one layer comprises a plurality of layers.

21. The method of claim 17 , wherein the plurality of via-holes and the plurality of dummy via-holes are formed in a mask operation.