Systems and processes that singulate materials

1. A method for material singulation, the method comprising:

focusing a first laser output from a first laser device to a depth within a material, the depth being located between a top surface of the material and a bottom surface of the material, the focused first laser output having a beam width in the material, the first laser output comprising ultrafast laser pulses having a duration less than or equal to 50 picoseconds, the first laser output having a wavelength selected from near-infrared and visible wavelengths;

applying the focused first laser output to the material along a beam path, an electric field of the ultrafast lasers pulses in the focused first laser output causing rapid acceleration of electrons, the focused first laser output thereby causing a permanent change in refractive index, optical absorption, density, or mechanical stress of the material exposed to the focused first laser output while the material exposed to the focused first laser output remains in a solid phase; and

sequentially applying a second laser output from a second laser device to the material along and directly adjacent to the beam path, the second laser output heating the material or generating an acoustic shockwave in the material, thereby separating the material along the beam path while reducing impartation of defects into the material, the second laser output having a beam width larger than the beam width of the focused first laser output, the second laser output having a higher average power and a lower peak power relative to the first laser output.

2. The method according to claim 1 , wherein the ultrafast laser pulses of the first laser output have a duration less than or equal to about one picosecond.

3. The method according to claim 1 , wherein the material exposed to the first laser output is modified by any of:

separating molecular bonds in material lattice;

geometrical reorientation of molecular constituents; and

spatial movement of molecular species.

4. The method according to claim 1 , wherein the second laser output heats the material and causes a discontinuous stress gradient in the material.

5. The method according to claim 1 , wherein the second laser output comprises a wavelength selected from a range of three to fifty micrometers, inclusive.

6. The method according to claim 1 , wherein the second laser output comprises a wavelength selected from a range of 0.78 to three micrometers, inclusive.

7. The method according to claim 1 , wherein a laser pulse duration of the second laser output is greater than or equal to ten picoseconds.

8. The method according to claim 1 , wherein the second laser output includes a continuous wave output.

9. The method according to claim 1 , wherein the steps of applying the first laser output and applying the second laser output occur within a second.

10. The method of claim 1 , wherein the applying the second laser output to the body that was exposed to the first laser output causes complete separation of the material into two or more pieces.

11. The method of claim 1 , wherein the first laser output and the second laser output are performed by using a single motion control.

12. The method of claim 1 , further comprising selectively adjusting an amount of electronic energy excitation by varying parameters of a laser device including a beam delivery speed and a beam energy level.

13. The method of claim 1 , further comprising inspecting the material by applying a light.

14. The method of claim 1 , wherein the second laser output comprises a wavelength in a range of 11 micrometers to 50 micrometers.