Technique for remanufacturing a medical sensor

1. A method of remanufacturing a used bandage-type medical sensor, comprising:

obtaining the used bandage-type medical sensor;

opening the used bandage-type medical sensor to expose a detector of the used bandage medical sensor;

surrounding the detector with an electrically conductive adhesive transfer tape (ECATT) layer to shield the detector from electromagnetic interference (EMI);

securing the ECATT layer to a nonconductive support layer;

disposing the nonconductive support layer around the detector; and

securing one or more new patient-contacting adhesive layers to the nonconductive support layer.

2. The method of claim 1 , comprising securing the detector directly to a nonconductive adhesive layer to electrically insulate the detector from the ECATT layer.

3. The method of claim 1 , comprising removing a metallic EMI shield from the detector prior to surrounding the detector with the ECATT layer.

4. The method of claim 1 , wherein opening the used bandage medical sensor comprises opening one or more layers of the used bandage medical sensor to expose the detector.

5. The method of claim 4 , comprising discarding the one or more layers of the used bandage medical sensor, wherein the ECATT layer and the nonconductive support layer are new.

6. The method of claim 5 , wherein discarding the one or more layers of the used bandage medical sensor comprises isolating the detector, an emitter of the used bandage medical sensor, and a cable connected to the detector and the emitter from the rest of the used bandage-type medical sensor.

7. The method of claim 6 , comprising:

providing a nonconductive adhesive layer, the ECATT layer, the nonconductive support layer, and at least one of the one or more new patient-contacting adhesive layers as at least a portion of a laminate assembly;

positioning the emitter, the detector, and a portion of the cable against the laminate assembly such that the detector is disposed over the ECATT layer; and

folding the laminate assembly over the emitter, the detector, and the portion of the cable to form a remanufactured sensor body.

8. The method of claim 4 , wherein the nonconductive support layer is one of the one or more layers, and wherein disposing the nonconductive support layer around the detector comprises re-sealing the one or more layers.

9. The method of claim 1 , comprising securing a cable termination of a cable attached to the detector to the ECATT layer.

10. The method of claim 1 , comprising:

detaching a used cable from the detector, the cable comprising a metallic EMI shield; and

attaching a new cable to the detector, the new cable comprising a conductive jacketing having a conductive filler disposed within a polymer matrix, and wherein the conductive jacketing is configured to shield a wire of the cable from EMI.

11. The method of claim 1 , wherein securing one or more new patient-contacting adhesive layers to the nonconductive support layer comprises:

securing a first patient-contacting adhesive layer directly to the nonconductive support layer prior to disposing the nonconductive support layer around the detector; and

securing a second patient-contacting adhesive layer directly to the nonconductive support layer after disposing the nonconductive support layer around the detector.

12. The method of claim 1 , wherein securing one or more new patient-contacting adhesive layers to the nonconductive support layer comprises securing a new patient-contacting adhesive layer to a used patient-contacting adhesive layer such that the used patient-contacting adhesive layer is completely covered by the new patient-contacting adhesive layer.

13. The method of claim 1 , comprising replacing a used patient-contacting adhesive bandage layer of the used bandage medical sensor with a new patient-contacting adhesive bandage layer.