Sensor for thermal analysis and systems including same
View Patent ↗Certain embodiments disclosed herein are directed to a sensor comprising a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.
1. A thermal analysis sensor, comprising:
a support member;
a reference sensor surrounding the support member; and
a sample sensor including a sample support coupled to the support member, the sample support configured to be received by the reference sensor, the sample support having an outer surface positioned less than or equal to about 0.5 mm from an inner surface of the reference sensor.
2. The sensor of claim 1 , in which the outer surface of the sample support is positioned about 0.25 mm from the inner surface of the reference sensor.
3. The sensor of claim 1 , wherein the reference sensor comprises a cylindrical ring and is operative to provide a reference signal without the addition of an external reference material.
4. The sensor of claim 1 , wherein the sample support is configured to receive a sample-containing crucible, and wherein the thermal analysis sensor is constructed and arranged such that the sample-containing crucible and the reference sensor occupy the same temperature zone.
5. The sensor of claim 1 , wherein the sample support is configured to receive a sample-containing crucible, and wherein the thermal analysis sensor is constructed and arranged to minimize thermal crosstalk between the sample and the reference sensor.
6. The sensor of claim 1 , wherein the reference sensor has an inner cross-sectional shape that differs from an outer cross-sectional shape of the reference sensor.
7. The sensor of claim 1 , wherein the reference sensor has a triangular cross-sectional geometry.
8. The sensor of claim 1 , wherein the reference sensor has a rectangular cross-sectional geometry.
9. The sensor of claim 1 , wherein the sample support and the reference sensor comprise the same material.
10. The sensor of claim 9 , wherein the material is platinum or a platinum alloy.
11. The sensor of claim 1 , wherein the sample support comprises a concave surface configured to receive a crucible.
12. The sensor of claim 11 , wherein the reference sensor has a heat capacity equal to the heat capacity of the sample support and crucible combined.
13. The sensor of claim 11 , wherein the thermal analysis sensor is constructed and arranged such that the reference sensor and crucible have substantially similar thermal properties.
14. The sensor of claim 1 , further comprising a first set of interconnects electrically coupled to the sample support and a second set of interconnects electrically coupled to the reference sensor.
15. The sensor of claim 14 , wherein the support member surrounds the first set of interconnects and the second set of interconnects.
16. The sensor of claim 14 , wherein each interconnect is surrounded by a longitudinal channel positioned within the support member.
17. The sensor of claim 14 , wherein each interconnect is insulated.