METHOD OF MANUFACTURING PACKAGES, PIEZOELECTRIC VIBRATORS OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK
The present invention provides a novel method of producing piezoelectric vibrators in which a plurality of substrates are formed at once from a wafer, and the wafer is formed with a plurality of electrode holes formed in the respective substrates. Using holders each having a plurality of electrode columns held thereon, the plurality of electrode columns are substantially simultaneously inserted in the electrode holes formed in the wafer.
1 . A method for producing piezoelectric vibrators, comprising:
(a) defining a plurality of first substrates on a first wafer and a plurality of second substrates on a second wafer;
(b) forming holes in a respective at least some of the first substrates on the first wafer;
(c) arranging multiple conductive columns standing at locations coincident with locations of at least some of the holes;
(d) substantially simultaneously inserting at least some of the conductive columns into corresponding holes; and
(e) securing at least some of the inserted conductive columns within corresponding holes.
2 . The method according to claim 1 , further comprising removing at least one main surface of the first wafer to expose both ends of the conductive columns from the first wafer.
3 . The method according to claim 1 further comprising:
(f) layering the first and second wafers such that at least some of the first substrates which have the conductive columns secured therein substantially coincide respectively with at least some of the corresponding second substrates;
(g) bonding at least some of the coinciding first and second substrate pairs; and
(h) cutting off a respective at least some of the bonded first and second substrate pairs from the layered first and second wafers.
4 . The method according to claim 1 , wherein forming holes comprises forming holes having a bottom at a depth greater than a length of the conductive column.
5 . The method according to claim 1 , wherein arranging multiple conductive columns comprises defining conductive columns in groups each comprising a holder that maintains a geometrical relationship of conductive columns standing from the holder.
6 . The method according to claim 4 , wherein arranging multiple conductive columns comprises arranging the holders each placed in contact with a neighboring holder.
7 . The method according to claim 4 , wherein defining conductive columns in groups comprises defining conductive columns in pairs in each of which the holder maintains a geometrical relationship of a pair of conductive columns standing from the holder.
8 . The method according to claim 4 , further comprising integrally forming the holder and the conductive columns standing from the holder.
9 . The method according to claim 8 , wherein integrally forming the holder and the conductive columns comprises forming the holder integral with the conductive columns by forging.
10 . The method according to claim 8 , wherein integrally forming the holder and the conductive columns comprises forming the holder integral with the conductive columns by half-banking.
11 . The method according to claim 8 , wherein integrally forming the holder and the conductive columns comprises forming the holder integral with the conductive columns by stamping.
12 . The method according to claim 1 , wherein securing at least some of the inserted conductive columns comprises pressing the first wafer under heat to close the holes in which the conductive columns are inserted.
13 . The method according to claim 1 , wherein securing at least some of the inserted conductive columns comprises using paste to fill at least some of the holes in which the conductive columns are inserted and heating the first wafer to harden the paste in the holes.