Light guide plate stamp and method of manufacturing the same
View Patent ↗A stamp includes a metal supporting layer, a pattern forming layer and an adhesive layer. The metal supporting layer has a first thermal conductivity. The pattern forming layer is disposed on the metal supporting layer and has a surface with a molding pattern formed thereon. The adhesive layer is disposed between the metal supporting layer and the pattern forming layer to couple the pattern forming layer to the metal supporting layer, and has a second thermal conductivity lower than the first thermal conductivity. Thus, strength of the stamp may be improved, and deformation of the stamp during the process of manufacturing a light guide plate may be reduced or prevented.
1. A stamp comprising:
a metal supporting layer having a first thermal conductivity;
a pattern forming layer disposed on the metal supporting layer, the pattern forming layer having a surface with a molding pattern formed thereon; and
an adhesive layer disposed between the metal supporting layer and the pattern forming layer to couple the pattern forming layer to the metal supporting layer, the adhesive layer having a second thermal conductivity lower than the first thermal conductivity.
2. The stamp of claim 1 , wherein the adhesive layer includes a fiber reinforced plastic.
3. The stamp of claim 1 , wherein the adhesive layer includes a polymer.
4. The stamp of claim 1 , wherein the pattern forming layer includes nickel.
5. A method of manufacturing a stamp, the method comprising:
disposing an adhesive layer on a metal supporting layer having a first thermal conductivity, the adhesive layer having a second thermal conductivity lower than the first thermal conductivity;
disposing a pattern forming layer on the adhesive layer, the pattern forming layer having a molding pattern on a first surface of the pattern forming layer; and
pressing the metal supporting layer, the adhesive layer and the pattern forming layer together.
6. The method of claim 5 , further comprising forming the pattern forming layer through an electroforming process.
7. The method of claim 6 , wherein forming the pattern forming layer further comprises:
forming a master having a copy pattern, which corresponds to the molding pattern, on a surface of the master;
forming an electroforming copy layer on the copy pattern of the master; and
separating the electroforming copy layer from the master, the electroforming copy layer having a surface with the molding pattern formed thereon.
8. The method of claim 7 , further comprising polishing a second surface of the electroforming copy layer to be substantially flat.
9. The method of claim 5 , further comprising polishing an exposed surface of the metal supporting layer.
10. The method of claim 5 , wherein the adhesive layer includes a fiber reinforced plastic.
11. The method of claim 5 , wherein the adhesive layer includes a polymer.