IP Library Patent Application 13242733
Patent Application
App. No. 13/242,733

QUICK DRYING SEMI-SOLID GLUES

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Quick Facts
Patent No.
US None
App. No.
13/242,733
Abstract

An exemplary embodiment discloses a shape memory polymer material (SMP) including a glue material chemically grafted onto a surface of the SMP material wherein the SMP material is capable of transforming between a permanent shape and a temporary shape.

Claims (53)

1 . A product comprising:

a glue material chemically grafted to a surface of an SMP material wherein said SMP material is capable of transforming between a permanent shape and a temporary shape.

2 . A product as set forth in claim 1 , wherein said SMP material comprises a single glass transition temperature (T g ).

3 . A product as set forth in claim 1 , wherein said SMP material comprises multiple glass transition temperatures (T g ).

4 . A product as set forth in claim 1 , wherein said SMP material comprises at least one of:

a rigid epoxy, a flexible epoxy, an epoxy extender, a flexible crosslinking agent, a rigid crosslinking agent, a catalytic curing agent, or a diluent.

5 . A product as set forth in claim 4 , wherein:

the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, the epoxy extender has one epoxide group, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, and an anhydride, and the diluent is a monoamine or a mono-carboxylic acid.

6 . A product as set forth in claim 4 , wherein the catalytic curing agent comprises at least one of tertiary amines, amine salts, boron trifluoride complexes, or amine borates.

7 . A product as set forth in claim 1 , wherein said SMP material comprises a rigid aromatic diepoxide (EPON 826), a flexible aliphatic diepoxide such as neopentyl glycol diglycidyl ether (NGDE), and an aliphatic diamine curing agent such as polypropylene glycol)bis(2-aminopropyl)ether (Jeffamine D-230).

8 . A product as set forth in claim 1 , wherein said glue material is capable of being solvated to become a solvated glue material while chemically grafted to said SMP material.

9 . A product as set forth in claim 1 , wherein said glue material comprises at least one of ethylene-vinyl acetate, polyvinyl alcohol, polyurethanes, polyester, ethylene-vinyl acetate, polyvinyl acetate (PVA), polysulfides, and polyvinyl chloride (PVC).

10 . A product as set forth in claim 1 , wherein said glue material has a thickness of from about 1 nm to about 1 micron.

11 . A product as set forth in claim 1 , wherein said SMP material is in a permanent shape.

12 . A product as set forth in claim 1 , wherein said SMP material is in a temporary shape.

13 . A method comprising:

providing a shape memory polymer (SMP) material wherein said SMP material is capable of transforming between a permanent shape and a temporary shape;

providing a glue chemically grafted to at least one surface of said SMP material;

heating said SMP material above a glass transition temperature T g comprising said SMP material;

contacting said glue with a solvent to solvate said glue;

contacting said solvated glue with at least a first substrate; and,

drying said solvated glue to form an adhesion bond to said at least a first substrate.

14 . The method of claim 13 , wherein said glue is attached to two surfaces of said SMP material and said solvated glued on each of said two surfaces is respectively contacted by said at least a first substrate and a second substrate.

15 . The method of claim 14 , wherein said SMP material is pressed between said at least a first substrate and said second substrate.

16 . The method of claim 13 , wherein said step of contacting said solvated glue with said at least a first substrate is performed under an applied stress.

17 . The method of claim 13 , wherein said step of drying comprises cooling below said T g said at least a first substrate contacted to said solvated glue surface.

18 . The method of claim 17 , wherein said cooling is performed under an applied stress.

19 . The method of claim 13 , wherein said step of contacting said glue with a solvent comprises at least one of dipping, spraying, or brushing.

20 . The method of claim 13 , wherein said SMP material comprises at least one of:

a rigid epoxy, a flexible epoxy, an epoxy extender, a flexible crosslinking agent, a rigid crosslinking agent, a catalytic curing agent, and a diluent.

21 . The method of claim 20 , wherein:

the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, the epoxy extender has one epoxide group, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, and an anhydride, and the diluent is a monoamine or a mono-carboxylic acid.

22 . The method of claim 20 , wherein the catalytic curing agent comprises at least one of tertiary amines, amine salts, boron trifluoride complexes, or amine borates.

23 . The method of claim 13 , wherein said SMP material comprises a rigid aromatic diepoxide (EPON 826), a flexible aliphatic diepoxide such as neopentyl glycol diglycidyl ether (NGDE), and an aliphatic diamine curing agent such as poly(propylene glycol)bis(2-aminopropyl)ether (Jeffamine D-230).

24 . The method of claim 13 , wherein said glue material comprises at least one of ethylene-vinyl acetate, polyvinyl alcohol, polyurethanes, polyester, ethylene-vinyl acetate, polyvinyl acetate (PVA), polysulfides, and polyvinyl chloride (PVC).

25 . The method of claim 13 , wherein said glue material has a thickness of from about 1 nm to about 1 micron.

26 . The method of claim 13 , wherein said SMP material is in a temporary shape following said step of drying.

27 . A product with an adhesion bond, said adhesion bond comprising:

at least one layer of shape memory polymer (SMP) material wherein said SMP material is capable of transforming between a permanent shape and a temporary shape;

a glue material chemically grafted to at least one surface of said SMP material; and,

at least one substrate glued to said at least one surface of said SMP material through said glue material comprising said adhesion bond.

28 . The product of claim 27 , wherein said SMP material comprises at least one glass transition temperature (T g ).

29 . The product of claim 27 , wherein said SMP material comprises at least one of:

a rigid epoxy, a flexible epoxy, an epoxy extender, a flexible crosslinking agent, a rigid crosslinking agent, a catalytic curing agent, or a diluent.

30 . The product of claim 29 , wherein:

the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, the epoxy extender has one epoxide group, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, and an anhydride, and the diluent is a monoamine or a mono-carboxylic acid.

31 . The product of claim 29 , wherein the catalytic curing agent comprises at least one of tertiary amines, amine salts, boron trifluoride complexes, or amine borates.

32 . The product of claim 27 , wherein said SMP material comprises a rigid aromatic diepoxide (EPON 826), a flexible aliphatic diepoxide such as neopentyl glycol diglycidyl ether (NGDE), and an aliphatic diamine curing agent such as poly(propylene glycol)bis(2-aminopropyl)ether (Jeffamine D-230).

33 . The product of claim 27 , wherein said glue material is capable of being solvated to become a solvated glue material while chemically grafted to said SMP material.

34 . The product of claim 27 , wherein said glue material comprises at least one of ethylene-vinyl acetate, polyvinyl alcohol, polyurethanes, polyester, ethylene-vinyl acetate, polyvinyl acetate (PVA), polysulfides, and polyvinyl chloride (PVC).

35 . The product of claim 27 , wherein said glue material has a thickness of from about 10 nm to about 1 micron.

36 . The product of claim 27 , wherein said SMP material is in a permanent shape.

37 . The product of claim 27 , wherein said SMP material is in a temporary shape.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034186/0776 →
SECURITY AGREEMENT Recorded Jun 28, 2012
From: GM GLOBAL TECHNOLOGY OPERATIONS LLC
To: WILMINGTON TRUST COMPANY
Reel/Frame 028458/0184 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2011
From: XIE, TAO
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 026960/0034 →