IP Library Granted Patent US 8,632,245
Granted Patent B2
US 8,632,245 · App. 13/243,197 · Granted Jan 21, 2014

Temperature sensor

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Quick Facts
Patent No.
US 8,632,245
App. No.
13/243,197
Granted
Jan 21, 2014
Kind
B2
Abstract

A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.

Claims (17)

1. A temperature sensor comprising:

a closed-bottom tubular shaped case;

a temperature detector element inserted and accommodated in the case; and

a filler filled in the case and sealing the temperature detector element,

a gap formed between the case and the temperature detector element,

the gap having a filler flowing portion formed along an insertion direction of the temperature detector element,

wherein the filler flowing portion is a larger gap than a remainder of the gap other than the filler flowing portion,

wherein the filler flowing portion is provided in an inner wall of the case so as to protrude outwardly in a radial direction,

wherein the remainder of the gap other than the filler flowing portion is smaller than the filler flowing portion.

2. The temperature sensor according to claim 1 , wherein the filler flowing portion is formed by forming an inner wall cross section of the case into a polygonal shape.

3. The temperature sensor according to claim 1 , wherein the filler is an adhesive agent containing a filler metal.

4. The temperature sensor according to claim 1 , wherein the case is provided with a base to be a package by postforming, forming an outer shape of a portion of the case that is supported by postforming mold into a cylindrical shape.

5. The temperature sensor according to claim 4 , wherein the case is divided into the portion supported by the postforming mold and a temperature conducting portion provided with the filler flowing portion.

6. The temperature sensor according to claim 1 , integrated with an on-vehicle pressure sensor.

7. The temperature sensor according to claim 1 , further comprising the gap having a first thickness and the filler flowing portion having a second thickness,

wherein the second thickness is greater than the first thickness.

8. The temperature sensor according to claim 1 , wherein the filler flowing portion allows for movement of the filler and the remainder of the gap is involved with temperature conduction between the case and the temperature detector element.

Assignments (1)
COMPANY SPLIT Recorded Sep 4, 2024
From: MITSUBISHI ELECTRIC CORPORATION
To: MITSUBISHI ELECTRIC MOBILITY CORPORATION
Reel/Frame 068834/0585 →