Organic luminescence display device having getter pattern and method of manufacturing the same
View Patent ↗Provided is a method of manufacturing an organic luminescence display device, the method including: bringing a getter powder into direct contact with a first surface of an encapsulation substrate; irradiating a laser to a second surface of the encapsulation substrate correspondingly to a getter pattern area to melt the second surface of the encapsulation substrate; and bonding the getter powder to the molten second surface of the encapsulation substrate to form a getter pattern corresponding to the getter pattern area. Since the getter powder is directly bonded to the encapsulation substrate by laser irradiation, a fine getter pattern may be formed.
1. A method of manufacturing an organic luminescence display device, the method comprising:
contacting a binder-free getter powder with an entire first surface of an encapsulation substrate;
irradiating a laser to a second surface of the encapsulation substrate correspondingly to a first getter pattern area sufficiently to melt the first surface of the encapsulation substrate while maintaining the contact of the getter powder and the entire first surface of the encapsulation substrate;
bonding the binder-free getter powder to the molten first surface of the encapsulation substrate to form a getter pattern corresponding to the first getter pattern area; and
removing the getter powder that contacts a portion of the first surface of the encapsulation substrate on which the getter pattern is not formed.
2. The method of claim 1 , further comprising:
dividing an upper surface of a substrate into a plurality of pixel areas and a second getter pattern area surrounding each of the plurality of pixel areas;
forming pixels in the plurality of pixel areas;
coating a sealant at an edge of the first surface of the encapsulation substrate on which the getter pattern is formed; and
bonding the substrate to the encapsulation substrate while the upper surface of the substrate faces the first surface of the encapsulation substrate;
wherein the getter pattern on the first surface of the encapsulation substrate does not contact the upper surface of the substrate.
3. The method of claim 2 , wherein in the bonding of the substrate to the encapsulation substrate, the plurality of pixel areas of the substrate and the getter pattern formed on the encapsulation substrate do not overlap each other, and wherein the first getter pattern area substantially corresponds to the second getter pattern area.
4. The method of claim 2 , wherein the plurality of pixel areas are formed in a matrix shape, and the second getter pattern area has a shape of a lattice pattern, surrounding the plurality of pixel areas.
5. The method of claim 1 , wherein in the contacting of the getter powder with the first surface of the encapsulation substrate, the first surface of the encapsulation substrate is disposed downward in the gravitational direction and the getter powder is disposed under the first surface of the encapsulation substrate.
6. The method of claim 1 , wherein the laser irradiation temperature is higher than the melting point of the encapsulation substrate and lower than a melting point of the getter powder.
7. The method of claim 1 , wherein the getter pattern is a single layer comprising getter powder.
8. The method of claim 1 , wherein the width of the getter pattern is dependent upon the width of the irradiated laser.
9. The method of claim 1 , wherein the getter powder is directly attached to the first surface of the encapsulation substrate without a separate adhesive.