Integrated circuits with phase change devices
View Patent ↗Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.
1. A method, comprising:
detecting when a state of a phase change die changes due to a temperature of an integrated circuit die exceeding a threshold;
sending a signal to a controller to take corrective action in response to the temperature of the integrated circuit die.
2. The method of claim 1 further comprising, reprogramming the phase change die to reset bits back to an initial state before the temperature of the integrated circuit die exceeded the threshold.
3. The method of claim 1 further comprising, increasing cooling to reduce the temperature of the integrated circuit die upon detecting that the temperature exceeds the threshold.
4. The method of claim 1 further comprising, wherein the corrective action includes shifting workload away from the integrated circuit die, increasing cooling to the integrated circuit die, and relocating power consumption at the integrated circuit die.
5. The method of claim 1 further comprising:
detecting a specific area of the integrated circuit die where temperature exceeded the threshold and where temperature did not exceed the threshold;
providing a targeted cooling to the specific area where the temperature exceeded the threshold.
6. The method of claim 1 further comprising, stacking a plurality of integrated circuit dies into a package, wherein one or more of the integrated circuit dies includes a phase change material to detect when a phase change material changes phases.
7. The method of claim 1 further comprising:
detecting when a first functional area of the integrated circuit die experiences a phase change to indicate excessive exposure to heat;
detecting when a second functional area of the integrated circuit die experiences a phase change to indicate excessive exposure to heat, wherein the first and second functional areas perform different processing functions.