Electronic device including finger sensor and related methods
View Patent ↗An electronic device may include a housing and circuitry carried by the housing. The electronic device may also include a finger sensing device carried by the housing and coupled to the circuitry. The finger sensing device may include a mounting substrate, and a semiconductor interposer having a lower surface adjacent the mounting substrate. The finger sensing device may also include a plurality of semiconductor finger sensing die on an upper surface of the semiconductor interposer in side-by-side and abutting relation, and defining a finger sensing surface to receive at least one finger thereon.
1. An electronic device comprising:
a housing;
circuitry carried by said housing; and
a finger sensing device carried by said housing and coupled to said circuitry, said finger sensing device comprising
a mounting substrate,
a semiconductor interposer having a lower surface adjacent said mounting substrate, and
a plurality of semiconductor finger sensing die on an upper surface of said semiconductor interposer in side-by-side and abutting relation, and defining a finger sensing surface to receive at least one finger thereon.
2. The electronic device of claim 1 , wherein said semiconductor interposer and said plurality of semiconductor finger sensing die each have a coefficient of thermal expansion (CTE) within ±20% of each other.
3. The electronic device of claim 1 , wherein each semiconductor finger sensing die includes an array of pixels defining a pixel pitch; and wherein each adjacent pair of semiconductor finger sensing die comprises opposing edge portions so that a spacing between pixels on opposing edge portions is not greater than 1.5 times the pixel pitch.
4. The electronic device of claim 3 , wherein said opposing edge portions define missing pixel positions; and further comprising a processor configured to generate image data for the missing pixel positions based upon adjacent pixels.
5. The electronic device of claim 1 , wherein said semiconductor interposer and said plurality of semiconductor finger sensing die each comprises a same semiconductor material.
6. The electronic device of claim 1 , wherein said plurality of semiconductor finger sensing die are arranged in a plurality of rows and a plurality of columns.
7. The electronic device of claim 6 , wherein at least one of the plurality of rows and plurality of columns is not greater than two.
8. The electronic device of claim 1 , wherein each of said plurality semiconductor finger sensing die comprises a plurality of bond pads along at least one side thereof on a periphery of said plurality of semiconductor finger sensing die.
9. The electronic device of claim 8 , wherein said mounting substrate comprises one of a ball grid array substrate and a land grid array substrate coupled to said plurality of bond pads.
10. The electronic device of claim 8 , further comprising a connector carried by said mounting substrate and coupled to said plurality of bond pads.
11. The electronic device of claim 1 , wherein said circuitry comprises a processor and a wireless transceiver coupled thereto.
12. The electronic device of claim 1 , further comprising a protection layer over said plurality of semiconductor finger sensing die.
13. A finger sensing device comprising:
a mounting substrate;
a semiconductor interposer having a lower surface adjacent said mounting substrate; and
a plurality of semiconductor finger sensing die on an upper surface of said semiconductor interposer in side-by-side and abutting relation, and defining a finger sensing surface to receive at least one finger thereon.
14. The finger sensing device of claim 13 , wherein said semiconductor interposer and said plurality of semiconductor finger sensing die each have a coefficient of thermal expansion (CTE) within ±20% of each other.
15. The finger sensing device of claim 13 , wherein each semiconductor finger sensing die includes an array of pixels defining a pixel pitch; and wherein each adjacent pair of semiconductor finger sensing die comprises opposing edge portions so that a spacing between pixels on opposing edge portions is not greater than 1.5 times the pixel pitch.
16. The finger sensing device of claim 13 , wherein said semiconductor interposer and said plurality of semiconductor finger sensing die each comprises a same semiconductor material.
17. The finger sensing device of claim 13 , wherein said plurality of semiconductor finger sensing die are arranged in a plurality of rows and a plurality of columns.
18. The finger sensing device of claim 17 , wherein at least one of the plurality of rows and plurality of columns is not greater than two.
19. The finger sensing device of claim 13 , wherein each of said plurality semiconductor finger sensing die comprises a plurality of bond pads along at least one side thereof on a periphery of said plurality of semiconductor finger sensing die.
20. The finger sensing device of claim 19 , wherein said mounting substrate comprises one of a ball grid array substrate and a land grid array substrate coupled to said plurality of bond pads.
21. The finger sensing device of claim 19 , further comprising a connector carried by said mounting substrate and coupled to said plurality of bond pads.
22. The finger sensing device of claim 13 , further comprising a protection layer over said plurality of semiconductor finger sensing die.
23. A method of making a finger sensing device comprising:
positioning a semiconductor interposer having a lower surface adjacent a mounting substrate; and
positioning a plurality of semiconductor finger sensing die on an upper surface of the semiconductor interposer in side-by-side and abutting relation to define a finger sensing surface to at least one finger thereon.
24. The method of claim 23 , wherein the semiconductor interposer and the plurality of semiconductor finger sensing die each have a coefficient of thermal expansion (CTE) within ±20% of each other.
25. The method of claim 23 , wherein each semiconductor finger sensing die includes an array of pixels defining a pixel pitch; and wherein each adjacent pair of semiconductor finger sensing die comprises opposing edge portions so that a spacing between pixels on opposing edge portions is not greater than 1.5 times the pixel pitch.
26. The method of claim 23 , wherein the semiconductor interposer and the plurality of semiconductor finger sensing die each comprises a same semiconductor material.
27. The method of claim 23 , wherein the plurality of semiconductor finger sensing die are arranged in a plurality of rows and a plurality of columns.
28. The method of claim 27 , wherein at least one of the plurality of rows and plurality of columns is not greater than two.
29. The method of claim 23 , further comprising a forming a protection layer over the plurality of semiconductor finger sensing die.