IP Library Granted Patent US 8,361,429
Granted Patent B2
US 8,361,429 · App. 13/245,249 · Granted Jan 29, 2013

Polycrystalline diamond materials and related products

Inventors: Michael A. Vail (Genola, UT); Kenneth E. Bertagnolli (Riverton, UT); Jason Wiggins (Draper, UT); Jiang Qian (Cedar Hills, UT); David P. Miess (Highland, UT)
Assignee: US Synthetic Corporation
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Quick Facts
Patent No.
US 8,361,429
App. No.
13/245,249
Granted
Jan 29, 2013
Kind
B2
Abstract

Embodiments relate to methods of fabricating PCD materials by subjecting a mixture that exhibits a broad diamond particle size distribution to an HPHT process, PCD materials so-formed, and PDCs including a polycrystalline diamond table comprising such PCD materials. In an embodiment, a PCD material includes a plurality of bonded diamond grains that exhibit a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is less than about 1.0. θ = x 6 · σ , where x is the average grain size of the substantially unimodal diamond grain size distribution, and σ is the standard deviation of the substantially unimodal diamond grain size distribution.

Claims (54)

1. A polycrystalline diamond material, comprising:

a plurality of bonded diamond grains, the plurality of bonded diamond grains exhibiting a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is about 0.25 to about 1.0; and

wherein:

θ

=

x

6

·

σ

;

x is the average grain size of the substantially unimodal diamond grain size distribution, and is about 5 μm to about 30 μm; and

σ is the standard deviation of the substantially unimodal diamond grain size distribution.

2. The polycrystalline diamond material of claim 1 wherein the parameter θ is about 0.3 to about 0.9.

3. The polycrystalline diamond material of claim 1 wherein the parameter θ is about 0.3 to about 0.7.

4. The polycrystalline diamond material of claim 1 wherein the parameter θ is about 0.5 to about 0.7.

5. The polycrystalline diamond material of claim 1 wherein the parameter θ is about 0.3 to about 0.4.

6. The polycrystalline diamond material of claim 1 wherein σ is about 2 μm to about 15 μm.

7. The polycrystalline diamond material of claim 1 wherein x is about 10 μm to about 20 μm, σ is about 4 μm to about 10 μm, and the parameter θ is about 0.3 to about 0.7.

8. The polycrystalline diamond material of claim 1 in which a thermal stability thereof is at least about as thermally stable as a partially leached polycrystalline diamond material having a leach depth of about 60 μm to about 70 μm and a different diamond grain size distribution.

9. A polycrystalline diamond compact, comprising a polycrystalline diamond table including the polycrystalline diamond material of claim 1 ; and

a substrate bonded to the polycrystalline diamond table.

10. The polycrystalline diamond compact of claim 9 wherein the substrate comprises a cemented-carbide material.

11. The polycrystalline diamond compact of claim 9 , being configured as a cutting element.

12. The polycrystalline diamond compact of claim 9 , being configured as a bearing element.

13. The polycrystalline diamond compact of claim 9 , being configured as at least part of a wire drawing die.

14. A polycrystalline diamond material, comprising:

a plurality of bonded diamond grains, the plurality of bonded diamond grains exhibiting a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is about 0.3 to about 0.7; and

wherein:

θ

=

x

6

·

σ

;

x is the average grain size of the substantially unimodal diamond grain size distribution and is about 10 μm to about 20 μm; and

σ is the standard deviation of the substantially unimodal diamond grain size distribution.

15. The polycrystalline diamond material of claim 14 wherein the parameter θ is about 0.5 to about 0.7.

16. The polycrystalline diamond material of claim 14 wherein the parameter θ is about 0.3 to about 0.4.

17. The polycrystalline diamond material of claim 14 wherein x is about 12 μm to about 15 μm and σ is about 6 μm to about 8.5 μm.

18. The polycrystalline diamond material of claim 14 wherein σ is about 4 μm to about 10 μm.

19. A polycrystalline diamond material, comprising:

a plurality of bonded diamond grains defining a plurality of interstitial regions, the plurality of bonded diamond grains exhibiting a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is about 0.3 to about 0.9;

wherein:

θ

=

x

6

·

σ

;

x is the average grain size of the substantially unimodal diamond grain size distribution and is about 10 μm to about 20 μm;

σ is the standard deviation of the substantially unimodal diamond grain size distribution; and

a catalyst material is disposed in at least a portion of the plurality of interstitial regions.

Continuity (2)
Division 12148927 · Apr 22, 2008
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