System, apparatus, and method for in-vivo assessment of relative position of an implant
View Patent ↗A method for providing an in-vivo assessment of relative movement of an implant that is positioned in a living being is provided wherein a first assembly and a second assembly are positioned within the living being. The first assembly includes a passive electrical resonant circuit that is configured to be selectively electromagnetically coupled to an ex-vivo source of RF energy and, in response to the electromagnetic coupling, generates an output signal characterized by a frequency that is dependent upon a distance between the first assembly and the second assembly at the time of the electromagnetic coupling.
1. A method for providing an in-vivo assessment of relative movement of an implant in a living being, the method comprising:
positioning a first assembly comprising a passive electrical resonant circuit within the living being; and
positioning a second assembly within the living being spaced from the first assembly;
selectively electromagnetically coupling the first assembly to an ex-vivo source of RF energy; and
generating an output signal from the first assembly, in response to the electromagnetic coupling, characterized by a frequency that is dependent upon a distance between the first assembly and the second assembly
wherein the characterized frequency is the resonant frequency of the first assembly dependent on the distance between the first assembly and the second assembly.
2. The method of claim 1 , wherein the second assembly comprises a metallic element.
3. The method of claim 1 , wherein the second assembly comprises a non-metallic element.
4. The method of claim 3 , wherein the non-metallic element exhibits magnetic properties.
5. The method of claim 1 , wherein the second assembly comprises a passive electrical circuit.
6. The method of claim 5 , wherein the passive electrical circuit of the second assembly comprises a passive electrical resonant circuit.
7. The method of claim 6 , wherein the passive electrical resonant circuit of the second assembly is substantially identical to the passive electrical resonant circuit of the first assembly.
8. The method of claim 6 , wherein the passive electrical resonant circuit of the second assembly comprises a LC resonant circuit.
9. The method of claim 8 , wherein the passive electrical resonant circuit of the first assembly comprises a LC resonant circuit.
10. The method of claim 9 , wherein a resonant frequency of the second assembly differs from a resonant frequency of the first assembly.
11. The method of claim 1 , wherein the passive electrical resonant circuit of the first assembly comprises a LC resonant circuit.
12. The method of claim 11 , wherein the LC resonant circuit of the first assembly comprises a coil inductor operably coupled to a capacitor.
13. The method of claim 12 , wherein the inductance of the LC resonant circuit is between about 5 to about 15 micro-Henry.
14. The method of claim 12 , wherein the resonant frequency of the LC resonant circuit is between about 25 to about 45 MHz.
15. The method of claim 12 , wherein the capacitance of the LC resonant circuit is between about 1 to about 20 pF.
16. The method of claim 12 , wherein, at a first distance between the first assembly and the second assembly, the first assembly generates, in response to the electromagnetic coupling, a first output signal having a first frequency, and wherein, at a second distance between the first assembly and the second assembly that differs from the first distance, the first assembly generates an output signal having a second frequency in response to the electromagnetic coupling that differs from the first frequency.
17. The method of claim 16 , wherein the coil inductor is a substantially planar spiral inductor.
18. The method of claim 16 , wherein the coil inductor has a longitudinal axis and wherein the coil inducted is elongated about the longitudinal axis.
19. The method of claim 16 , wherein at least a portion of each winding of the coil inductor is non-planar with respect to the longitudinal axis.
20. The method of claim 1 , wherein at least one of the first assembly and the second assembly is coupled to a portion of the implant.
21. The method of claim 20 , wherein at least one of the first assembly and the second assembly is coupled to bone tissue proximate the implant.
22. The method of claim 21 , wherein both the first assembly and the second assembly are coupled to spaced portions of the implant.
23. The method of claim 1 , wherein a portion of the implant forms the second assembly.
24. The method of claim 23 , wherein the portion of the implant forming the second assembly is metallic.
25. The method of claim 1 , wherein the implant comprises a prosthetic device for preserving motion between adjacent bones.
26. The method of claim 1 , wherein the implant comprises an intervertebral cage.