Reconfigurable shape memory polymer tooling supports
View Patent ↗A method and support apparatus for providing structural support to a mold or mandrel, such as a shape memory polymer (SMP) apparatus configured for shaping a composite part. The support apparatus may comprise a rigid structural member and a plurality of SMP cells attached thereto and configured to inflate or deploy in a malleable state toward and against a surface of the SMP apparatus, mold, or mandrel. Then the SMP cells may be returned to a rigid state while still pressed against this surface, thereby providing structural support when composite material is applied to an opposite surface of the SMP apparatus, mold, or mandrel. After the composite material is cured into the finished composite part, the SMP cells may be deflated or otherwise collapse toward the structural member to provide enough clearance to be removed from the cured composite part.
1. A support apparatus configured for providing internal support to a mold, tooling, or SMP apparatus for forming composite parts, the support apparatus comprising:
a rigid structural member that remains rigid when heated to a temperature sufficient for curing a composite part;
a plurality of deployable SMP cells made of shape memory polymer (SMP) configured to be actuated to transition between a rigid state and a malleable state;
a pressurization system configured to deploy the SMP cells to extend from the rigid structural member when in the malleable state;
wherein the rigid structural member has a plurality of openings formed therethrough and aligned with the SMP cells, wherein the SMP cells are each in fluid communication with the pressurization system and are configured to deploy through the openings formed through the rigid structural member and to transfer load to the rigid structural member; and
wherein the SMP cells are actuatable via the pressurization system between an inverted configuration in which the SMP cells extend from the rigid structural member in a first direction and a deployed configuration in which the SMP cells are driven through the openings in a second direction opposite of the first direction.
2. The support apparatus of claim 1 , wherein the SMP cells are configured to be in the rigid state at a temperature below T g and to become malleable at a temperature above T g .
3. The support apparatus of claim 2 , wherein the pressurization system comprises a pressure source and a heat exchanger configured to force heated or cooled liquid or gas into or through the SMP cells to actuate the SMP cells from the rigid state to the malleable state or from the malleable state to the rigid state.
4. The support apparatus of claim 1 , wherein the SMP cells each comprise an attachment portion at which the SMP cell is attached to the rigid structural member, wherein the attachment portion is configured to remain rigid while the remainder of the SMP cell is in the malleable state.
5. The support apparatus of claim 1 , wherein the rigid structural member comprises a base component and a tray supported by and fixedly spaced apart from the base component, wherein the plurality of openings of the rigid structural member are formed through the tray.
6. The support apparatus of claim 1 , further comprising a plurality of rigid containers fixed between the base component and the tray, the containers each having a first opening aligned with the openings formed through the tray and a second opening in fluid communication with the pressurization system, wherein the SMP cells extend within the containers in the inverted configuration and extend at least partially outward of the containers in the deployed configuration.
7. The support apparatus of claim 1 , wherein the SMP cells are configured to be flexible in the malleable state and to not stretch or increase in surface area when actuated by the pressurization system to deploy.
8. The support apparatus of claim 1 , wherein the SMP cells comprise a first portion and a second portion arranged in a stepped configuration, such that a cross-section of the first portion encompasses a greater area than a cross-section of the second portion.
9. The support apparatus of claim 1 , wherein at least some of the SMP cells are elongated, having a length greater than a width and a height thereof.
10. The support apparatus of claim 1 , wherein the pressurization system comprises a pressure source, a plurality of tubes through which pressurized gas from the pressure source may flow to the SMP cells, and a plurality of valves configured to independently control pressurization of one or more of the SMP cells.
11. An apparatus forforming composite parts, wherein the apparatus comprises:
an SMP apparatus formed of shape memory polymer (SMP), having an inner surface and an outer surface, wherein the outer surface of the SMP apparatus is shaped and configured to form an inner surface of the composite part; and
a support apparatus in contact with the inner surface of the SMP apparatus, the support apparatus comprising:
a rigid structural member that remains rigid when heated to a temperature suitable for curing a composite part;
a plurality of hollow deployable SMP cells made of shape memory polymer (SMP) and configured to be rigid at temperatures below T g and to become malleable at temperatures above T g , wherein the SMP cells are attached to the rigid structural member and contact the inner surface of the SMP apparatus; and
a pressurization system configured to pressurize the SMP cells, such that the SMP cells are actuated to press away from the rigid structural member and against the SMP apparatus when heated to a temperature above T g ,
wherein the SMP cells are actuatable via the pressurization system between an inverted configuration in which the SMP cells extend from the rigid structural member in a first direction and a deployed configuration in which the SMP cells are driven outward to extend from the rigid structural member in a second direction opposite of the first direction,
wherein the SMP cells provide a rigid load path between the SMP apparatus and the rigid structural member when cooled below T g while pressed against the inner surface of the SMP apparatus.