Comprehensive method of electrical fluid heating system fault detection and handling
View Patent ↗A method and system are provided to eliminate the risk of over temperature concerns associated with electrical heating devices, which if undetected may result in an electrical over temperature condition. The electrical heating system may be applied to the detection and control structure of other automotive electrical loads where thermal concerns may exist. The electrical heating system combines several layers of fault detection strategies, to form a unique comprehensive approach to prevent and detect potential electrical fault conditions, which if undetected and/or controlled may result in an electrical over temperature condition.
1. A heating system for a vehicle, the system comprising:
a heating control module comprising a microprocessor configured for heating fault detection and heating fault handling, a first field effect transistor (FET) operatively connected to the microprocessor, and a second field effect transistor (FET) operatively connected to the microprocessor; and
a heating module comprising a heating element, a first thermistor operatively connected to the microprocessor, and a second thermistor operatively connected to the microprocessor;
wherein the microprocessor is configured to:
determine a fault condition when a temperature difference between a first temperature of the first thermistor and a second temperature of the second thermistor exceeds a temperature difference threshold;
determine the fault condition when at least one of the first temperature of the first thermistor and the second temperature of the second thermistor is less than a minimum temperature after the first FET is powered on and the second FET is powered on;
determine the fault condition when the first FET is powered on and the second FET is powered off and when the microprocessor does not detect logic voltage at an analog input; and
determine the fault condition when the first FET is powered off and the second FET is powered off and when the microprocessor does not detect half the logic voltage at the analog input.
2. The heating system of claim 1 , wherein the microprocessor is configured to:
determine the fault condition when at least one of the first temperature of the first thermistor and the second temperature of the second thermistor exceeds a temperature specification;
determine the fault condition when the first FET is powered off and the second FET is powered on and when the microprocessor does not detect 0 volts at the analog input; and
determine the fault condition when the first FET is powered on and the second FET is powered on and when the microprocessor does not detect half the logic voltage at the analog input.
3. The heating system of claim 1 , wherein the microprocessor is configured to:
determine the fault condition when a current from the first FET does not equal a current from the second FET;
determine the fault condition when the current from the first FET exceeds a current threshold; and
determine the fault condition when the current from the second FET exceeds the current threshold.
4. The heating system of claim 1 , wherein a source of the first FET is operatively connected to a battery through a relay; and
wherein a drain of the first FET is operatively connected to the heating element.
5. The heating system of claim 1 , wherein a source of the second FET is operatively connected to the heating element; and
wherein a drain of the second FET is operatively connected to ground.
6. The heating system of claim 1 , wherein a gate of the first FET is operatively connected to the microprocessor and a gate of the second FET is operatively connected to the microprocessor.
7. The heating system of claim 1 , wherein the microprocessor is configured to detect fault conditions by monitoring at least one of the following: the analog input, the first FET, the second FET, the first thermistor, and the second thermistor.
8. The heating system of claim 1 , wherein a top of the heating control module and a top of the heating module are angled at least at a 15 degree angle.
9. The heating system of claim 1 , wherein the microprocessor is configured to determine normal operation of the heating system:
when the first FET is powered on and the second FET is powered off and when the microprocessor detects logic voltage at the analog input; and
when the first FET is powered off and the second FET is powered off and when the microprocessor detects half the logic voltage at the analog input.
10. The heating system of claim 1 , wherein the microprocessor is configured to determine normal operation of the heating system:
when the first FET is powered off and the second FET is powered on and when the microprocessor detects ground at the analog input;
when the first FET is powered on and the second FET is powered on and when the microprocessor detects half logic power voltage at the analog input; and
when the first FET is powered on and the second FET is powered on and when the microprocessor detects that a current from the first FET equals a current from the second FET.
11. A method for a heating system of a vehicle, the method comprising:
configuring a heating control module comprising a microprocessor configured for heating fault detection and heating fault handling, a first field effect transistor (FET) operatively connected to the microprocessor, and a second field effect transistor (FET) operatively connected to the microprocessor; and
configuring a heating module comprising a heating element, a first thermistor operatively connected to the microprocessor, and a second thermistor operatively connected to the microprocessor;
wherein the microprocessor is configured to:
determine a fault condition when a temperature difference between a first temperature of the first thermistor and a second temperature of the second thermistor exceeds a temperature difference threshold;
determine the fault condition when at least one of the first temperature of the first thermistor and the second temperature of the second thermistor is less than a minimum temperature after the first FET is powered on and the second FET is powered on;
determine the fault condition when the first FET is powered on and the second FET is powered off and when the microprocessor does not detect logic voltage at an analog input; and
determine the fault condition when the first FET is powered off and the second FET is powered off and when the microprocessor does not detect half the logic voltage at the analog input.
12. The method of claim 11 , wherein the microprocessor is configured to:
determine the fault condition when at least one of the first temperature of the first thermistor and the second temperature of the second thermistor exceeds a temperature specification;
determine the fault condition when the first FET is powered off and the second FET is powered on and when the microprocessor does not detect 0 volts at the analog input; and
determine the fault condition when the first FET is powered on and the second FET is powered on and when the microprocessor does not detect half the logic voltage at the analog input.
13. The method of claim 11 , wherein the microprocessor is configured to:
determine the fault condition when a current from the first FET does not equal a current from the second FET;
determine the fault condition when the current from the first FET exceeds a current threshold; and
determine the fault condition when the current from the second FET exceeds the current threshold.
14. The method of claim 11 , wherein a source of the first FET is operatively connected to a battery through a relay; and
wherein a drain of the first FET is operatively connected to the heating element.
15. The method of claim 11 , wherein a source of the second FET is operatively connected to the heating element; and
wherein a drain of the second FET is operatively connected to ground.
16. The method of claim 11 , wherein a gate of the first FET is operatively connected to the microprocessor and a gate of the second FET is operatively connected to the microprocessor.
17. The method of claim 11 , wherein the microprocessor is configured to detects fault conditions by monitoring at least one of the following: the analog input, the first FET, the second FET, the first thermistor, and the second thermistor.
18. The method of claim 11 , wherein a top of the heating control module and a top of the heating module are angled at least at a 15 degree angle.
19. The method of claim 11 , wherein the microprocessor is configured to determine normal operation of the heating system:
when the first FET is powered on and the second FET is powered off and when the microprocessor detects logic voltage at the analog input; and
when the first FET is powered off and the second FET is powered off and when the microprocessor detects half the logic voltage at the analog input.
20. The method of claim 11 , wherein the microprocessor is configured to determine normal operation of the heating system:
when the first FET is powered off and the second FET is powered on and when the microprocessor detects ground at the analog input;
when the first FET is powered on and the second FET is powered on and when the microprocessor detects half logic power voltage at the analog input; and
when the first FET is powered on and the second FET is powered on and when the microprocessor detects that a current from the first FET equals a current from the second FET.