Methods for fabricating planar heater structures for ejection devices
View Patent ↗Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.
1. A method for fabricating a planar heater structure for an ejection device, the method comprising:
providing a substrate wafer, the substrate wafer comprising a plurality of plugs configured therewithin, each plug of the plurality of plugs being formed as an electrical connection and composed of a first metallic material;
depositing and patterning a layer of a second metallic material over the substrate wafer, the patterning leaving a patterned layer of isolated sections of electrical conductors aligned vertically above said each plug and exposing a surface of the substrate wafer;
providing a layer of a dielectric material of a predetermined thickness over the surface of the substrate wafer and the patterned layer of the isolated sections of electrical conductors;
conducting chemical mechanical polishing of the layer of the dielectric material and a topmost portion of the patterned layer to form a planarized top surface exposing the patterned layer of the isolated sections of electrical conductors;
cleaning the planarized top surface; and thereafter forming a resistive heater element to eject fluid, including
depositing and patterning a resistor film over the planarized top surface thereby connecting either ends of the resistor film to the isolated sections of electrical conductors and to said each plug;
depositing one or more blanket films over the patterned resistor film; and
patterning and etching the one or more blanket films.
2. The method of claim 1 , further comprising depositing a protective layer on a top surface of the layer of the second metallic material prior to patterning the layer of the second metallic material.
3. The method of claim 1 , further comprising depositing a protective layer on a top surface of the layer of the second metallic material after patterning the layer of the second metallic material.
4. The method of claim 1 , wherein the first metallic material is tungsten, and the second metallic material is aluminum.
5. The method of claim 1 , wherein the dielectric material is methylsilsesquioxane.
6. The method of claim 1 , wherein each blanket film of the one or more blanket films is one of silicon based blanket film and tantalum based blanket film.