Organic light emitting display device and electronic device including the same
View Patent ↗An organic light emitting display device has the function of buffering external impacts so as to improve the resistance of the organic light emitting display device to impact. An electronic device includes the organic light emitting display device. The organic light emitting display device includes: a frame; a first substrate disposed on the frame, a display unit being formed on a surface of the first substrate; a second substrate disposed so as to face the first substrate; a driver integrated circuit (IC) disposed on either the first substrate or the second substrate; and a buffer member formed so as to cover the driver IC.
1. An electronic device comprising an organic light emitting display device and a housing for accommodating the organic light emitting display device:
said organic light emitting display device comprising:
a frame;
a first substrate disposed on the frame, a display unit being formed on a surface of the first substrate;
a second substrate disposed so as to face the first substrate;
a driver integrated circuit (IC) disposed on one of the first substrate and the second substrate; and
a buffer member formed so as to cover the driver IC;
said electronic device further comprising a compressed buffer tape interposed between the housing and the first substrate;
wherein the compressed buffer tape is closely adhered to, and in direct contact with, both the housing and the first substrate with no elements disposed between the compressed buffer tape and the housing, and with no elements disposed between compressed buffer tape and the first substrate,
wherein a lower surface of the first substrate facing away from the second substrate is in immediate contact with the frame.
2. The electronic device of claim 1 , wherein the substrate on which the driver IC is disposed, as selected from the first substrate and the second substrate, is longer than the substrate on which the driver IC is not disposed, and the driver IC is disposed on an extended portion of the substrate on which the driver IC is disposed.
3. The electronic device of claim 2 , said electronic device further comprising:
a transparent protection window disposed in front of the housing.
4. The electronic device of claim 3 , wherein the buffer member is disposed between the first substrate and the transparent protection window.
5. The electronic device of claim 4 , wherein the buffer member is disposed so as to contact the first substrate and the transparent protection window, respectively.
6. The electronic device of claim 3 , wherein the housing and the frame are closely adhered to each other. respectively.
7. The electronic device of claim 1 , wherein the frame and the first substrate are closely adhered to each other.
8. The electronic device of claim 7 , said electronic device further comprising:
a transparent protection window disposed in front of the housing.
9. The electronic device of claim 8 , wherein the buffer member is disposed between the first substrate and the transparent protection window.
10. The electronic device of claim 9 , wherein the buffer member is disposed so as to contact the first substrate and the transparent protection window, respectively.
11. The electronic device of claim 8 , wherein the housing and the frame are closely adhered to each other.
12. The electronic device of claim 1 , said electronic device further comprising:
a transparent protection window disposed in front of the housing.
13. The electronic device of claim 12 , wherein the buffer member is disposed between the first substrate and the transparent protection window.
14. The electronic device of claim 13 , wherein the buffer member is disposed so as to contact the first substrate and the transparent protection window, respectively.
15. The electronic device of claim 12 , wherein the housing and the frame are closely adhered to each other.