IP Library Granted Patent US 9,190,706
Granted Patent B2
US 9,190,706 · App. 13/249,189 · Granted Nov 17, 2015

Passive waveguide components manufactured by three dimensional printing and injection molding techniques

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Quick Facts
Patent No.
US 9,190,706
App. No.
13/249,189
Granted
Nov 17, 2015
Kind
B2
Abstract

Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.

Claims (24)

1. A waveguide manufactured by the steps of:

creating a design mold for the waveguide using a three-dimensional printer; receiving the design mold;

receiving a non-conductive material;

fabricating a non-conductive structure of the waveguide using a plastic injection molding process, the fabricating the non-conductive structure being based on the design mold, wherein the non-conductive structure comprises the non-conductive material; and

forming a conductive layer on an exposed surface of at least one non-conductive structural feature of the non-conductive structure to create an electrical feature of the waveguide.

2. The waveguide of claim 1 , wherein the non-conductive material comprises plastic, ceramic, or wood.

3. The waveguide of claim 1 , wherein forming the conductive layer on the exposed surface of the at least one non-conductive structural feature of the non-conductive structure comprises plating the exposed surface with a conductive material.

4. The waveguide of claim 1 , wherein the waveguide is manufactured by the additional step of trimming or polishing the non-conductive structure or the conductive layer.

5. The waveguide of claim 1 , wherein the conductive layer comprises copper or silver.

6. The waveguide of claim 1 , wherein the conductive layer has a thickness that enables the electrical feature of the waveguide to function within an accepted parameter.

7. The waveguide of claim 1 , wherein the waveguide is manufactured by the additional step of cleaning the non-conductive structure to remove debris left behind by fabrication.

8. The waveguide of claim 1 , wherein the waveguide is manufactured by the additional step of identifying, in the design mold, a plane through the at least one non-conductive structural feature, wherein the plane is an E-plane of the waveguide or an H-plane of the waveguide.

9. The waveguide of claim 1 , wherein the waveguide is further manufactured by the steps of:

identifying, in the design mold, a first structural feature of the waveguide that is not implementable as a non-conductive structural feature of the non-conductive structure; and

modifying, in the design mold, the first structural feature to a second structural feature, wherein the second structural feature is implementable as a non-conductive structural feature of the non-conductive structure.

10. The waveguide of claim 1 , wherein the waveguide is further manufactured by the steps of:

identifying, in the design mold, a plane through the waveguide along which the waveguide may be split into a plurality of separate structural features, wherein the plurality of seperate structural features is adapted for fabrication as a plurality of separate non-conductive structural features of the non-conductive structure and wherein the plurality of separate structural features is adapted for receiving the conductive layer; and

splitting, in the design mold, the waveguide along the plane, thereby resulting in the plurality of separate structural features.

11. The waveguide of claim 10 , wherein fabricating the non-conductive structure based on the design mold comprises fabricating the plurality of separate structural features of the waveguide as the plurality of separate non-conductive structural features of the non-conductive structure.

12. The waveguide of claim 11 , wherein the waveguide is further manufactured by the step of assembling the plurality of separate non-conductive structural features of the non-conductive structure.

13. The waveguide of claim 1 , wherein the waveguide comprises a waveguide filter, a waveguide diplexer, a waveguide multiplexer, a waveguide bend, a waveguide transition, a waveguide spacer, or an antenna adapter.

14. The waveguide of claim 1 , wherein the waveguide is further manufactured by the steps of:

measuring performance of the electrical feature of the waveguide; and

modifying the design mold for the waveguide based on the performance.

Assignments (2)
SECURITY INTEREST Recorded Jan 18, 2024
From: AVIAT NETWORKS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 066351/0322 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2011
From: NATH, JAYESH; SHEN, YING; NEALIS, EDWIN
To: AVIAT U.S., INC.
Reel/Frame 027418/0779 →