Simulating apparatus for simulating integrated circuit
View Patent ↗A device to simulate an integrated circuit (IC) includes a main body, a simulating signal generating module, and a converting module. The simulating signal generating module is positioned on the main body and generates signals indicative of signals of the IC. The converting module is positioned on the main body and converts the signals from digital to analog form. The connecting board is assembled to the main body and sends the converted signals to a printed circuit board (PCB).
1. A simulating apparatus used to simulate an integrated circuit (IC), comprising:
a main body, comprising:
a base board defining a plurality of receiving holes;
a simulating portion, comprising a mounting board mounted on the base board and a simulating signal generating module positioned on the mounting board, the simulating signal generating module generating simulating signals indicative of signals of the IC; and
a converting portion comprising a mounting block mounted on the base board; and
a converting module positioned on the mounting block and electrically connected to the simulating signal generating module, the converting module converting the simulating signals from digital to analog form; and
a connecting board assembled to the base board, and configured for sending the converted simulating signals to a printed circuit board (PCB), the connecting board comprising a plurality of contact members protruding from one surface of the connecting board and a plurality of conductive pads attached to opposite surface of the connecting board corresponding to the contact members, the contact members received in the receiving holes;
wherein arrangement of the conductive pads corresponds to pins of the IC being simulated so that when the connecting board is attached to the PCB, the conductive pads send the converted simulating signals to the PCB.
2. The simulating apparatus of claim 1 , wherein the simulating signal generating module is selected from the group consisting of a control IC, a drive IC and a metallic oxide semiconductor field effect transistor.
3. The simulating apparatus of claim 1 , further comprising a connector positioned on the mounting block.
4. The simulating apparatus of claim 1 , further comprising a plurality of heat sink fins positioned on the mounting block.
5. A simulating apparatus used to simulate an integrated circuit (IC), comprising:
a main body, comprising:
a simulating signal generating module positioned on the main body and generating simulating signals indicative of signals of the IC; and
a converting module positioned on the main body and converting the simulating signals from digital to analog form; and
a connecting board assembled to the main body and sending the converted simulating signals to a printed circuit board (PCB), the connecting board comprising a plurality of conductive pads attached to one surface of the connecting board;
wherein arrangement of the conductive pads corresponds to pins of the IC being simulated so that when the connecting board is attached to the PCB, the conductive pads send the converted simulating signals to the PCB.
6. The simulating apparatus of claim 5 , wherein the main body defines a plurality of receiving holes, the connecting board comprises a plurality of contact members protruding from another surface of the connecting board opposite to the one surface having conductive pads attached, and received in the receiving holes.
7. The simulating apparatus of claim 5 , wherein the simulating signal generating module is selected from one of the group consisting of a control IC, a drive IC, and a metallic oxide semiconductor field effect transistor.
8. The simulating apparatus of claim 5 , further comprising a connector positioned on the main body.
9. The simulating apparatus of claim 5 , further comprising a plurality of heat sink fins on the main body.