Assembly with a printed circuit board
View Patent ↗An assembly ( 10 ) comprises a housing ( 11 ) and a printed circuit board ( 14 ) received in the housing. The housing includes a housing body ( 12 ) and a cover ( 16 ). The housing body ( 12 ) has a first surface ( 26 ) supporting the printed circuit board ( 14 ) and also has a portion defining a second surface ( 22 ) receiving the cover ( 16 ). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface ( 22 ) is spaced from the first surface ( 26 ) by a distance that is at least as great as a thickness of the printed circuit board ( 14 ). The printed circuit board ( 14 ) is at least partially held in place by melted material from said portion.
1. An assembly comprising a housing, a printed circuit board received in the housing, and a cover, the housing including a housing body having (a) a cover support surface and (b) a printed circuit board support surface that is recessed from said cover support surface by a distance that is at least as great as a thickness of the printed circuit board and within an interior of the housing body, the housing body including a bottom wall and a side wall extending upwardly from the bottom wall, the housing body also including a plurality of spaced ribs projecting inwardly from the side wall and upwardly from the bottom wall, each rib having a top surface and a rib support surface adjacent to and spaced vertically from the top surface, the printed circuit board support surface including the rib support surfaces of the plurality of spaced ribs, the printed circuit board being in contact with the rib support surfaces, the side wall including an upper surface spaced vertically from the bottom wall and from the rib support surfaces of the plurality of spaced ribs, at least a portion of the housing body being formed of a material that is meltable, the printed circuit board being at least partially held in place in the housing body by melted material from said portion, the melted material contacting the printed circuit board and being at least one of (a) material from the side wall adjacent the upper surface and (b) material from the ribs.
2. The assembly of claim 1 wherein the melted material is melted using a laser.
3. The assembly of claim 1 wherein the cover is joined to the housing body by the melted material.
4. The assembly of claim 1 wherein at least one projection is formed on an interior surface of the housing body to engage the printed circuit board and help clamp the printed circuit board in the housing.
5. The assembly of claim 1 wherein at least one projection is formed on the cover to engage the printed circuit board and help clamp the printed circuit board in the housing.
6. The assembly of claim 1 wherein said portion of the housing body defines the cover support surface.
7. The assembly of claim 1 wherein the cover support surface includes the upper surface of the side wall, the cover being in contact with the upper surface of the side wall.
8. The assembly of claim 1 wherein the melted material overlies the printed circuit board.