Solar substrate ribbon bonding system
An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
1. An ultrasonic solar substrate bonding system comprising:
a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates;
a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and the plurality of solar substrates; and
an XY table, the bond head assembly being carried by the XY table, the ribbon feeding system including a ribbon guide carried by the XY table, the ribbon guide being configured to guide the portions of the continuous length of the ribbon material from a ribbon supply to a position proximate the bonding tool, wherein the bond head assembly is configured to travel along a substantially vertical axis, independent of the ribbon guide, such that the bonding tool is adapted to form the ultrasonic bonds between the portions of the continuous length of the ribbon material and the plurality of solar substrates.
2. The bonding system of claim 1 wherein the plurality of solar substrates are crystalline solar cells.
3. The bonding system of claim 1 wherein each of the plurality of solar substrates includes a frontside having exposed active solar material configured for receiving light energy and converting the light energy into electrical energy, and a backside at least partially defined by an electrically conductive region.
4. The bonding system of claim 3 wherein the bonding tool forms the ultrasonic bonds between (1) the portions of the continuous length of the ribbon material, and (2) the backside of ones of the plurality of solar substrates.
5. The bonding system of claim 1 further comprising an alignment unit configured to position ones of the plurality of solar substrates in a predetermined position prior to bonding by the bonding tool.
6. The bonding system of claim 5 further comprising a camera for imaging ones of the plurality of solar substrates prior to bonding by the bonding tool.
7. The bonding system of claim 6 wherein images from the camera are used to assist the alignment unit in positioning ones of the plurality of solar substrates.
8. The bonding system of claim 1 further comprising a cutter carried by the bond head assembly and proximate the bonding tool.
9. The bonding system of claim 8 wherein the bond head assembly is configured to rotate in an XY plane about a theta (θ) axis such that the cutter rotates about the theta (θ) axis with the bond head assembly.
10. The bonding system of claim 8 wherein the bonding tool is positioned between the cutter and the ribbon guide.
11. The bonding system of claim 8 wherein the cutter is positioned between the bonding tool and the ribbon guide.
12. The bonding system of claim 1 wherein the ribbon guide includes a terminal portion proximate the bonding tool to limit placement of the portions of the continuous length of the ribbon material proximate the bonding tool within a predetermined range in a Y direction.
13. The bonding system of claim 1 wherein the ribbon guide includes a roller mechanism configured to guide and feed the ribbon material to the bonding tool.
14. The bonding system of claim 1 wherein the ribbon supply is a spool of the ribbon material.
15. The bonding system of claim 1 further comprising a tensioner positioned between the ribbon supply and the ribbon guide, the tensioner being configured to provide a predetermined amount of tension to the portions of the continuous length of the ribbon material between the ribbon supply and the tensioner.
16. The bonding system of claim 15 wherein the tensioner is configured to feed the portions of the continuous length of the ribbon material through the ribbon guide.
17. The bonding system of claim 1 further comprising a pressing member proximate the bonding tool and carried by the bond head assembly, the pressing member configured to press against the portions of the continuous length of the ribbon material adjacent the ultrasonic bonds, the pressing member being moveable with respect to the bond head assembly independent of movement of the bonding tool.
18. The bonding system of claim 1 further comprising a second bond head assembly including a second bonding tool, wherein the second bond head assembly is positioned adjacent the bond head assembly such that respective separate lengths of the ribbon material are sequentially bonded to ones of the plurality of solar substrates by the bonding tool and by the second bonding tool.
19. The bonding system of claim 18 wherein the respective separate lengths of the ribbon material are bonded to ones of the plurality of solar substrates in a substantially parallel configuration.
20. The bonding system of claim 1 further comprising a material handling system for supporting and transporting ones of the plurality of solar substrates, the ultrasonic solar substrate bonding system also comprising a second bond head assembly including a second bonding tool, wherein the second bond head assembly is positioned on an opposing side of the material handling system with respect to the bond head assembly.
21. The bonding system of claim 20 wherein the bonding tool and the second bonding tool are configured to bond respective separate lengths of the ribbon material to ones of the plurality of solar substrates.
22. The bonding system of claim 20 wherein the respective separate lengths of the ribbon material are bonded to ones of the plurality of solar substrates in a substantially parallel configuration.
23. The bonding system of claim 20 further comprising a material handling system configured to:
(a) support ones of the plurality of solar substrates upstream of the bond head assembly;
(b) position the ones of the plurality of solar substrates under the bond head assembly for bonding by the bond head assembly; and
(c) support bonded ones of the plurality of solar substrates downstream of the bond head assembly.
24. The bonding system of claim 23 wherein the material handling system comprises a walking beam structure configured to move the ones of the plurality of solar substrates with respect to the bond head assembly, and a workholder structure configured to support the ones of the plurality of solar substrates during a ribbon bonding operation.
25. The bonding system of claim 24 wherein at least one of the walking beam structure and the workholder structure includes a plurality of through-holes.
26. The bonding system of claim 25 wherein a negative fluid pressure is drawn through the plurality of through-holes to retain the ones of the plurality of solar substrates in a position along the material handling system.