IP Library Granted Patent US 8,735,923
Granted Patent B2
US 8,735,923 · App. 13/251,897 · Granted May 27, 2014

Semiconductor light emitting device and manufacturing method thereof

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Quick Facts
Patent No.
US 8,735,923
App. No.
13/251,897
Granted
May 27, 2014
Kind
B2
Abstract

There is provided a semiconductor light emitting device and method of making the same, having a first conductivity type semiconductor layer; an active layer formed on the first conductivity type semiconductor layer; a second conductivity type semiconductor layer formed on the active layer and including a plurality of holes; and a transparent electrode formed on the second conductivity type semiconductor layer.

Claims (17)

1. A semiconductor light emitting device, comprising:

a first conductivity type semiconductor layer;

an active layer disposed on the first conductivity type semiconductor layer;

a second conductivity type semiconductor layer disposed on the active layer and including a plurality of holes having a depth less than the entire thickness of the second conductivity type semiconductor; and

a transparent electrode disposed on the second conductivity type semiconductor layer, wherein:

the transparent electrode has a plurality of protrusive portions on a light emitting surface thereof, and

the plurality of protrusive portions are disposed above corresponding ones of the holes defined in the second conductivity type semiconductor layer.

2. The semiconductor light emitting device of claim 1 , wherein the plurality of holes are disposed in a thickness direction of the second conductivity type semiconductor layer.

3. The semiconductor light emitting device of claim 1 , wherein the plurality of holes are filled with a light transmissive material having a refractive index lower than that of the second conductivity type semiconductor layer.

4. The semiconductor light emitting device of claim 1 , wherein the plurality of holes are filled with air.

5. The semiconductor light emitting device of claim 1 , wherein the transparent electrode is formed without filling the plurality of holes.

6. The semiconductor light emitting device of claim 1 , wherein the plurality of protrusive portions have a uniform shape.

7. The semiconductor light emitting device of claim 1 , wherein the plurality of protrusive portions have a lenticular, hemispherical, prismatic, conic, or polypyramidical shape.

8. The semiconductor light emitting device of claim 1 , wherein the plurality of holes are disposed on the one surface of the second conductivity type semiconductor layer that is opposite to a surface of the second conductivity type semiconductor layer contacting the active layer.

9. The semiconductor light emitting device of claim 1 , wherein a surface of the second conductivity type semiconductor layer contacting the active layer does not have holes formed therein.

10. The semiconductor light emitting device of claim 1 , wherein the transparent electrode is provided on the one surface of the second conductivity type semiconductor layer having the plurality of holes.

11. The semiconductor light emitting device of claim 10 , wherein the transparent electrode is provided on the one surface of the second conductivity type semiconductor layer so as not to extend into the plurality of holes.

Assignments (1)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →