Semiconducting polymers and optoelectronic devices incorporating same
View Patent ↗The present invention relates to certain polymeric compounds based upon a head-to-head (H—H) alkylthio-substituted bithiophene repeating units (e.g., 3,3′-bis(tetradecylthio)-2,2′-bithiophene). Such compounds can exhibit desirable electronic properties and possess processing advantages including solution-processability and/or good stability at ambient conditions.
1. An electronic, optical or optoelectronic device comprising a polymeric semiconductor component, wherein the polymeric semiconductor component comprises a polymer comprising a repeating unit of formula (I):
wherein R a is a linear C 1-40 alkyl or haloalkyl group or a branched C 3-40 alkyl or haloalkyl group, provided that at least one of R a is selected from
wherein R a ′ and R a ″, independently are a linear C 1-20 alkyl or haloalkyl group; and
wherein the polymer has an average molecular weight in the range of about 3,000 to about 300,000.
2. The device of claim 1 , wherein the polymer comprises at least one other repeating unit that is different from the repeating unit of formula (I).
3. The device of claim 2 , wherein the polymer comprises at least one other repeating unit, the other repeating unit comprising an optionally substituted polycyclic 8-14 membered heteroaryl group, the optionally substituted polycyclic 8-14 membered heteroaryl group comprising at least one sulfur atom.
4. The device of claim 1 , wherein the polymer further comprises a repeating unit of formula (VI), (VII), (VIII) or (IX):
5. The device of claim 2 , wherein the polymer is an alternating copolymer.
6. The device of claim 1 , wherein the polymer has a degree of polymerization between 5 and 5,000.
7. The device of claim 1 configured as a thin film transistor comprising a substrate, a source electrode, a drain electrode, a gate electrode, a gate dielectric component, and the polymeric semiconductor component in contact with the source electrode and the drain electrode, wherein the gate dielectric component is in contact with the semiconductor component on one side and the gate electrode on an opposite side.