Curable compositions containing cyclic diamine and cured products therefrom
View Patent ↗A curable composition including (a) at least one cyclic diamine, (b) at least one non-heterocyclic amine that has a pKa value of approximately 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the cyclic diamine compared to the total amine hydrogens from both the cyclic diamine and the non-heterocyclic amine in the composition are greater than about 5%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition.
1. A curable composition comprising (a) at least one cyclic diamine, wherein the at least one cyclic diamine comprises piperazine, homo-piperazine or mixtures thereof; (b) at least one non-heterocyclic amine that has a pKa value of 10.74 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the piperazine, homo-piperazine or mixtures thereof compared to the total amine hydrogens from both the piperazine, homo-piperazine or mixtures thereof and the non-heterocyclic amine in the composition are greater than about 45%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition; and (iv) wherein the curable composition has a reactivity equal to or greater than a reactivity of the curable composition above where (a) and (b) are substituted with N-aminoethylpiperazine (AEP) and satisfying the conditions (ii) and (iii).
2. The composition of claim 1 , wherein the at least one non-heterocyclic amine comprises 3,3′-dimethyl-4,4′-diamino-dicyclohexylmethane, 4,4′-diaminodicyclohexylmethane, isophoronediamine or mixtures thereof.
3. The composition of claim 1 , wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is from about 1 to about 2.
4. The composition of claim 1 , wherein the at least one epoxy resin comprises diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F or mixtures thereof.
5. The composition of claim 1 , wherein the at least one alkylated phenol comprises nonylphenol, monostyrenated phenol, pentadecylphenol or mixtures thereof.
6. The composition of claim 1 , wherein the concentration of the at least one alkylated phenol comprises from about 10 weight percent to about 65 weight percent.
7. The composition of claim 1 , including at least one catalyst.
8. The composition of claim 1 , including at least one filler comprising talc, polyethylene fibers or mixtures thereof.
9. The composition of claim 1 , including at least one aggregate comprising sand, gravel, crushed stone, slag, recycled concrete or mixtures thereof.
10. A thermoset product comprising a product obtained from the polymerization of the composition of claim 1 .
11. A process for preparing a curable composition comprising admixing (a) at least one cyclic diamine, wherein the at least one cyclic diamine comprises piperazine, homo-piperazine or mixtures thereof; (b) at least one non-heterocyclic amine that has a pKa value of 10.74 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the piperazine, homo-piperazine or mixtures thereof compared to the total amine hydrogens from both the piperazine, homo-piperazine or mixtures thereof and the non-heterocyclic amine in the composition are greater than about 45%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; and (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition; and (iv) wherein the curable composition has a reactivity equal to or greater than a reactivity of the curable composition above where (a) and (b) are substituted with N-aminoethylpiperazine (AEP) and satisfying the conditions (ii) and (iii).
12. A curable composition comprising (a) at least one cyclic diamine, wherein the at least one cyclic diamine comprises piperazine, homo-piperazine or mixtures thereof; (b) at least one non-heterocyclic amine that has a pKa value of 9.5 to about 12 at 25° C. for the most basic amine group in the non-heterocyclic amine molecule, (c) at least one epoxy resin, and (d) at least one alkylated phenol; (i) wherein the equivalents of the amine hydrogens from the piperazine, homo-piperazine or mixtures thereof compared to the total amine hydrogens from both the piperazine, homo-piperazine or mixtures thereof and the non-heterocyclic amine in the composition are greater than about 45%; (ii) wherein the ratio of the equivalents of the total amine hydrogens in the composition to the equivalents of the total epoxies in the composition is greater than or equal to about 1; (iii) wherein the alkylated phenol is in an amount greater than about 10 wt % of the curable composition; and (iv) wherein the curable composition has a reactivity equal to or greater than a reactivity of the curable composition above where (a) and (b) are substituted with N-aminoethylpiperazine (AEP) and satisfying the conditions (ii) and (iii).