Optoelectronic component
View Patent ↗An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.
1. An optoelectronic component comprising:
an optoelectronic semiconductor chip,
a contact frame,
a contact carrier,
a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each comprise part of the contact frame and part of the contact carrier, wherein
1) the contact frame is provided with a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, 2) the contact frame is provided with a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip, and 3) the optoelectronic semiconductor chip is arranged on the contact carrier of the second connection zone and electrically connected wirelessly with the contact carrier and the optoelectronic semiconductor chip is not arranged on the contact frame of the second connection zone.
2. The optoelectronic component according to claim 1 , wherein
the contact element is part of the first connection zone and electrically connects the optoelectronic semiconductor chip wirelessly with the first connection zone.
3. The optoelectronic component according to claim 1 , wherein
the contact frame and the contact carrier are a one-piece construction.
4. The optoelectronic component according to claim 3 , wherein
the contact frame and the contact carrier are made in one piece from sheet metal and the sheet metal is subdivided to form the first and second connection zones.
5. The optoelectronic component according to claim 1 , wherein
the contact frame and the contact carrier are two separate elements.
6. The optoelectronic component according to claim 5 , wherein
the contact frame is arranged on the contact carrier.
7. The optoelectronic component according to claim 5 , wherein the contact frame is adhesively bonded, eutectically bonded or soldered in selected locations to the contact carrier.
8. The optoelectronic component according to claim 5 , wherein
the contact frame is made from sheet metal.
9. The optoelectronic component according to claim 5 , wherein the contact carrier is made from sheet metal.
10. The optoelectronic component according to claim 5 , wherein the contact carrier comprises a substrate with at least one electrically conductive zone, and the substrate contains a ceramic material, a semiconductor material or a plastics material.
11. The optoelectronic component according to claim 1 , wherein the contact frame comprises further recesses on a side facing or remote from the contact carrier.
12. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip, contact frame and contact carrier are embedded in an encapsulation.
13. The optoelectronic component according to claim 11 , wherein the further recesses are filled with the encapsulation material.
14. The optoelectronic component according to claim 1 , further comprising another semiconductor chip, wherein the contact frame comprises a further contact element connected with the another semiconductor chip, and wherein the optoelectronic semiconductor chip and the another semiconductor chip are connected in series, in parallel or in antiparallel.
15. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip is directly arranged on the contact carrier of the second connection zone.
16. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip is soldered to the contact carrier of the second connection zone.