Wafer carrier track
View Patent ↗Embodiments of the invention generally relate to apparatuses for chemical vapor deposition (CVD) processes. In one embodiment, a wafer carrier track for levitating and traversing a wafer carrier within a vapor deposition reactor system is provided which includes upper and lower sections of a track assembly having a gas cavity formed therebetween. A guide path extends along an upper surface of the upper section and between two side surfaces which extend along and above the guide path and parallel to each other. A plurality of gas holes along the guide path extends from the upper surface of the upper section, through the upper section, and into the gas cavity. In some examples, the upper and lower sections of the track assembly may independently contain quartz, and in some examples, may be fused together.
1. A wafer carrier track for levitating and traversing a wafer carrier within a vapor deposition reactor system, comprising:
an upper section of a track assembly disposed over a lower section of the track assembly;
a gas cavity formed between the upper and lower sections of the track assembly;
a guide path extending along an upper surface of the upper section;
two side surfaces extending along and above the guide path and parallel to each other, wherein the guide path extends between the two die surfaces;
a plurality of gas holes within the guide path and extending from the upper surface of the upper section, through the upper section, and into the gas cavity; and
an upper lap joint disposed at one end of the track assembly and a lower lap joint disposed at the opposite end of the track assembly, wherein the upper lap joint extends a portion of the guide path and the two side surfaces and the lower lap joint comprises an upper surface extending further than the guide path and the two side surfaces of the track assembly and wherein a gas port extends from a side surface of the upper section of the track assembly, through a portion of the upper section of the track assembly, and into the gas cavity.
2. The wafer carrier track of claim 1 , further comprising a levitating wafer carrier disposed on the guide path, and the levitating wafer carrier comprises at least one indentation disposed within a lower surface.
3. A wafer carrier track system comprising at least two wafer carrier tracks of claim 1 , comprising:
an upper lap joint of a first wafer carrier disposed over a lower lap joint of a second wafer carrier track;
an exhaust port formed between the upper lap joint of the first wafer carrier track and the lower lap joint of the second wafer carrier track; and
a first guide path on an upper surface of the first wafer carrier track aligned with a second guide path on an upper surface of the second wafer carrier track.
4. The wafer carrier track of claim 3 , comprising:
an upper lap joint of the second wafer carrier track disposed over a lower lap joint of a third wafer carrier track.
5. A wafer carrier track for levitating and traversing a wafer carrier within a vapor deposition reactor system, comprising:
a track assembly having a gas cavity formed within;
a guide path extending along an upper surface of the track assembly;
a plurality of gas holes within the guide path and extending from the upper surface of the track assembly and into the gas cavity; and
an upper lap joint disposed at one end of the track assembly and a lower lap joint disposed at the opposite end of the track assembly, wherein the upper lap joint extends a portion of the guide path and the lower lap joint comprises an upper surface extending further than the guide path of the track assembly, wherein a gas port extends from a side surface of the track assembly and into the gas cavity.
6. The wafer carrier of claim 5 , further comprising at least one side surface disposed on the track assembly and extending along and above the guide path.
7. The wafer carrier track of claim 6 , wherein two side surfaces disposed on the track assembly and extending along and above the guide path.
8. The wafer carrier track of claim 7 , wherein the guide path extends between the two side surfaces.
9. The wafer carrier track of claim 5 , further comprising an upper section of the track assembly disposed over a lower section of the track assembly.
10. The wafer carrier track of claim 9 , wherein the upper section of the track assembly comprises the guide path extending along the upper surface.
11. The wafer carrier track of claim 9 , wherein the gas cavity is formed between the upper and lower sections of the track assembly.
12. The wafer carrier track of claim 9 , wherein the upper section and the lower section of the track assembly are fused together.
13. The wafer carrier track of claim 5 , further comprising a levitating wafer carrier disposed on the guide path, and the levitating wafer carrier comprises at least one indentation disposed within a lower surface.