IP Library Granted Patent US 9,006,763
Granted Patent B2
US 9,006,763 · App. 13/257,805 · Granted Apr 14, 2015

Semiconductor light-emitting device and light source device using the same

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Quick Facts
Patent No.
US 9,006,763
App. No.
13/257,805
Granted
Apr 14, 2015
Kind
B2
Abstract

A semiconductor light-emitting device according to the present invention is a semiconductor light-emitting device 10 including a solid-state light-emitting element 11 and a wavelength converter 12 that converts primary light emitted by the solid-state light-emitting element 11 into light having a longer wavelength, wherein the wavelength converter 12 includes a wavelength converting layer 12 a made from a translucent inorganic formed body containing phosphors, and a binder layer 12 b ; the wavelength converter 12 is disposed on a main light extraction surface 11 a of the solid-state light-emitting element 11 ; and the binder layer 12 b is disposed along an emission direction of light emitted from the main light extraction surface 11 a.

Claims (20)

1. A semiconductor light-emitting device comprising:

a solid-state light-emitting element; and

a wavelength converter that converts primary light emitted by the solid-state light-emitting element into light having a longer wavelength, wherein

the wavelength converter includes a binder layer comprising a phosphor and a wavelength converting layer made from a single phosphor ceramic,

the phosphor of the binder layer consists of a red phosphor,

the wavelength converting layer is divided by the binder layer,

the wavelength converter is disposed on a main light extraction surface of the solid-state light-emitting element, and

the binder layer is disposed along an emission direction of light emitted from the main light extraction surface.

2. The semiconductor light-emitting device according to claim 1 , wherein the binder layer is disposed in a direction perpendicular to the main light extraction surface.

3. The semiconductor light-emitting device according to claim 1 , wherein the binder layer penetrates through the wavelength converter.

4. The semiconductor light-emitting device according to claim 1 , wherein the wavelength converter is adhered to the main light extraction surface of the solid-state light-emitting element via a translucent adhesive layer.

5. The semiconductor light-emitting device according to claim 4 ; wherein the adhesive layer is composed of the same material as that of the binder layer.

6. The semiconductor light-emitting device according to claim 1 , wherein the solid-state light-emitting element includes a power supply electrode on a side of the main light extraction surface, and the wavelength converter is disposed on the main light extraction surface in such a manner as to avoid the power supply electrode.

7. The semiconductor light-emitting device according to claim 1 , wherein the solid-state light-emitting element includes a n-type wiring, and the wavelength converter is disposed on the main light extraction surface in such a manner as to avoid the n-type wiring.

8. The semiconductor light-emitting device according to claim 1 , wherein the binder layer has a function of mixing, by light scattering, at least a part of the primary light emitted by the solid-state light-emitting element, and a part of light emitted by the wavelength converter, the part of the primary light being a part thereof passing through the binder layer.

9. The semiconductor light-emitting device according to claim 8 , wherein the binder layer includes one or more materials with a light-scattering function or light-shielding function that are selected from the group consisting of Y 2 O 3 , Al 2 O 3 , SiO 2 , ZrO 2 , glass beads and bubbles.

10. The semiconductor light-emitting device according to claim 1 , wherein the binder layer has a function of blocking, at least partially, a part of the primary light emitted by the solid-state light-emitting element, the part of the primary light being a part thereof entering the binder layer.

11. The semiconductor light-emitting device according to claim 10 , wherein the binder layer includes one or more materials with a light-scattering function or light-shielding function that are selected from the group consisting of Y 2 O 3 , Al 2 O 3 , SiO 2 , ZrO 2 , glass beads and bubbles.

12. The semiconductor light-emitting device according to claim 1 , wherein the wavelength converting layer exists continuously from the solid-state light-emitting element toward an outward direction.

13. A light source device comprising the semiconductor light-emitting device according to claim 1 .

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2011
From: UENO, YASUHARU; KURACHI, TOSHIAKI
To: PANASONIC CORPORATION
Reel/Frame 027279/0833 →