IP Library Granted Patent US 8,715,558
Granted Patent B2
US 8,715,558 · App. 13/257,948 · Granted May 6, 2014

Capillary electrophoresis chips

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Quick Facts
Patent No.
US 8,715,558
App. No.
13/257,948
Granted
May 6, 2014
Kind
B2
Abstract

A seamless microchannel with aligned microelectrodes structure can be prepared to include a polymeric body defining a surface of a seamless microchannel. The microchannel is seamless in that it is formed by a single body of material having a conduit that is open at one surface and extends to another opening aligned with microelectrodes in another surface of the body. The rest of the microchannel is closed and defined by the single body of material. The seamless microchannel structure can be used in methods that include biosensors, coupling waveguides, capillary electrophoresis chips, microreactors, polymerase chain reaction-chips, and solving mathematical problems.

Claims (18)

1. A method of manufacturing a microchannel structure, the method comprising:

providing a vessel having a body defining an internal chamber that has at least a first opening and a second opening;

introducing a micron scale dimensioned wire into the internal chamber;

polymerizing a polymerizable composition within the internal chamber around the wire;

removing the wire from the polymerizable composition before substantially full polymerization thereof to thereby leave only the polymerizable composition in the internal chamber prior to completing the polymerization; and

completing the polymerization polymerizable composition to form a polymeric body defining a seamless microchannel having a smooth, continuous surface without any junctions.

2. The method of claim 1 , comprising providing a vessel having a body defining an internal chamber that has a first opening and a second opening.

3. The method of claim 1 , comprising forming first and/or second openings in the vessel.

4. The method of claim , comprising removing or breaking a seal at first or second openings of the vessel.

5. The method of claim 1 , comprising introducing the polymerizable composition into the vessel through the first or the second opening.

6. The method of claim 1 , comprising forming an electrode space between the vessel and polymerizable composition.

7. The method of claim 1 , comprising inserting a medium into an opening in the vessel before removing the wire, the medium being configured for facilitating removal of the wire from the polymerizable composition.

8. The method of claim 1 , comprising extending and securing the wire across the internal chamber.

9. The method of claim 1 , comprising positioning the wire to be substantially straight.

10. The method of claim 1 , comprising positioning the wire to have one or more bends.

11. The method of claim 1 , comprising positioning one or more wires to have one or more intersections or have two or more branches.

12. The method of claim 1 , wherein the wire has a substantially uniform cross-sectional profile.

13. The method of claim 1 , comprising inserting a medium into an opening in the vessel before removing the wire, the medium being configured for facilitating removal of the wire from the polymerizable composition.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jul 31, 2019
From: CRESTLINE DIRECT FINANCE, L.P.
To: EMPIRE TECHNOLOGY DEVELOPMENT LLC
Reel/Frame 049924/0794 →
SECURITY INTEREST Recorded Jan 29, 2019
From: EMPIRE TECHNOLOGY DEVELOPMENT LLC
To: CRESTLINE DIRECT FINANCE, L.P.
Reel/Frame 048373/0217 →