Material for packaging electronic components

1. A material for packaging of electronic components comprising a carrier layer and a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non-conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims, wherein the electrically conductive rim has a meandered shape, more than two cells meeting each other at a rim node, a width of an amplitude of a meandered rim increasing from a rim node to a maximum and then decreasing toward a next rim node.

2. The material according to claim 1 , wherein the structured layer at least partially covers the carrier layer.

3. The material according to claim 1 , wherein the structured layer and the carrier layer are arranged in a substantially parallel manner.

4. The material according to claim 1 , wherein the distance between every rim node of one cell is substantially equal.

5. The material according to claim 1 , wherein every cell of the mesh has three rim nodes or four rim nodes.

6. The material according to claim 1 , wherein the length of the electrically conductive rim between two rim nodes is substantially equal.

7. The material according to claim 1 , wherein the mesh of cells has a substantially repetitive and/or periodic pattern.

8. The material according to claim 1 , wherein the electrically conductive rim comprises at least one electrically conductive branch extending from the electrically conductive rim.

9. The material according to claim 1 , wherein the structured layer comprises metal, semiconductor and/or electrically conductive plastics.

10. The material according to claim 1 , wherein the carrier layer comprises plastic, cardboard, wood and/or paper.