Precision spacing for stacked wafer assemblies
View Patent ↗An assembly including a first wafer, a second wafer, a spacing wafer configured to be positioned between the first wafer and the second wafer, and a plurality of spacing elements configured to be positioned within the spacing wafer and to contact the first wafer and the second wafer, the spacing elements sized to define a first spacing distance between the first wafer and the second wafer.
1. An assembly comprising:
a first wafer;
a second wafer;
a spacing wafer configured to be positioned between the first wafer and the second wafer; and
a plurality of removable and reusable spacing elements configured to be positioned within the spacing wafer and to contact the first wafer and the second wafer, the removable and reusable spacing elements sized to define a first spacing distance between the first wafer and the second wafer.
2. The assembly of claim 1 , wherein the spacing wafer includes a plurality of holes therethrough, wherein each of the plurality of removable and reusable spacing elements is configured to be positioned within a hole.
3. The assembly of claim 1 , wherein the spacing wafer is bonded to both the first wafer and the second wafer forming a bonded wafer assembly configured to be dissected into a plurality of assemblies and scrap material.
4. The assembly of claim 3 , wherein the removable and reusable spacing elements are contained within the scrap material.
5. The assembly of claim 1 , wherein each of the plurality of removable and reusable spacing elements is manufactured from at least one of a materials group consisting of glass, metal, ceramic, sapphire and zirconia.
6. The assembly of claim 1 , wherein each of the plurality of removable and reusable spacing elements is manufactured such that at least one dimension of a removable and reusable spacing element equals the first spacing distance.
7. The assembly of claim 1 , wherein each of the plurality of removable and reusable spacing elements is a sphere having a diameter equal to the first spacing distance.
8. The assembly of claim 1 , wherein the first wafer and the second wafer are lens wafers.
9. The assembly of claim 1 , wherein the plurality of removable and reusable spacing elements are further configured to accurately define a thickness of the assembly.
10. The assembly of claim 1 , wherein the plurality of removable and reusable spacing elements are further configured to be usable in a second assembly.
11. An assembly comprising:
a first wafer comprising an inner face;
a second wafer comprising an inner face;
a spacing wafer comprising a first face, a second face, and a plurality of holes therethrough, the spacing wafer positioned between the first wafer and the second wafer such that the first face of the spacing wafer is positioned to be bonded to the inner face of the first wafer, and the second face of the spacing wafer is positioned to be bonded to the inner face of the second wafer; and
a plurality of removable and reusable spacing elements positioned within at least a portion of the plurality of holes and in contact with both the inner face of the first wafer and the inner face of the second wafer, the removable and reusable spacing elements configured to define a first spacing distance between the first wafer and the second wafer.
12. The assembly of claim 11 , wherein the spacing wafer is bonded to both the first wafer and the second wafer forming a bonded wafer assembly configured to be dissected into a plurality of assemblies and scrap material.
13. The assembly of claim 12 , wherein the removable and reusable spacing elements are contained within the scrap material.
14. The assembly of claim 11 , wherein each of the plurality of removable and reusable spacing elements is manufactured from at least one of a materials group consisting of glass, metal, ceramic, sapphire and zirconia.
15. The assembly of claim 11 , wherein each of the plurality of removable and reusable spacing elements is manufactured such that at least one dimension of the spacing element equals the first spacing distance.
16. The assembly of claim 11 , wherein each of the plurality of removable and reusable spacing elements is a sphere having a diameter equal to the first spacing distance.
17. The assembly of claim 11 , wherein the first wafer and the second wafer are lens wafers.
18. The assembly of claim 11 , wherein the plurality of removable and reusable spacing elements are further configured to accurately define a thickness of the assembly.
19. The assembly of claim 11 , wherein the plurality of removable and reusable spacing elements are further configured to be usable in a second assembly.