IP Library Granted Patent US 8,445,848
Granted Patent B2
US 8,445,848 · App. 13/262,301 · Granted May 21, 2013

Infrared array sensor

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Quick Facts
Patent No.
US 8,445,848
App. No.
13/262,301
Granted
May 21, 2013
Kind
B2
Abstract

An infrared array sensor includes: a base substrate; cavities which have array structure and are formed on a surface side of the base substrate; and pixel parts supported by the base substrate to cover the cavities, respectively. Each of the pixel parts includes a membrane structure that includes segmented membrane structures divided by slits. Each of the segmented membrane structures includes a thermosensor. Each membrane structure of the pixel parts includes a coupling piece for connecting its own segmented membrane structures to each other.

Claims (28)

1. An infrared array sensor, comprising:

a base substrate comprising first and second surfaces;

cavities which have array structure and are formed on the first surface side of the base substrate; and

pixel parts which are supported by the base substrate to cover the cavities, respectively, each of the pixel parts comprising a membrane structure,

wherein each membrane structure of the pixel parts comprises segmented membrane structures divided by slits, each of the segmented membrane structures comprising a thermosensor,

wherein each membrane structure of the pixel parts comprises a coupling piece for coupling its own segmented membrane structures to each other.

2. The infrared array sensor of claim 1 , wherein each membrane structure of the pixel parts comprises thermosensors that are electrically connected to each other so that a sum of each absolute value output of the thermosensors is obtained.

3. The infrared array sensor of claim 1 ,

wherein each thermosensor of the pixel parts is a thermopile;

wherein thermosensors of each membrane structure of the pixel parts are electrically connected in series to each other so that a sum of each absolute value output of the thermosensors is obtained.

4. The infrared array sensor of claim 1 ,

wherein each of said segmented membrane structures is supported by the base substrate through a bridge part,

wherein said bridge part and the segmented membrane structure supported by the base substrate therethrough are in the shape of a rectangle surrounded by two or three slits, and

wherein said two or three slits are divided by one or two coupling pieces.

5. The infrared array sensor of claim 4 ,

wherein each inner circumference of the cavities is in the shape of a rectangle,

wherein said segmented membrane structures comprise two segmented membrane structures arranged so as to approach to each other from both sides of an opening of a corresponding cavity, and

wherein said two segmented membrane structures are coupled to each other by said one or two coupling pieces.

6. The infrared array sensor of claim 4 ,

wherein each inner circumference of the cavities is in the shape of a rectangle,

wherein said segmented membrane structures comprise two segmented membrane structures laying next to each other along one side of an opening of a corresponding cavity, and

wherein said two segmented membrane structures are coupled to each other by said one coupling piece.

7. The infrared array sensor of claim 4 , wherein chamfer parts are formed between both side edges of said coupling piece and a side edge of the segmented membrane structure, respectively.

8. The infrared array sensor of claim 4 , wherein the coupling piece comprises a reinforced layer for reinforcing the coupling piece.

9. The infrared array sensor of claim 1 , wherein each of the cavities is in the shape of a four-sided pyramid.

10. The infrared array sensor of claim 1 , wherein each of the cavities comprises an opening at the second surface side of the base substrate.

11. The infrared array sensor of claim 10 , wherein the base substrate comprises an opening including the cavities at the second surface side of the base substrate.

12. The infrared array sensor of claim 1 , wherein each inner face of the cavities is a concave curve.

Assignments (2)
MERGER Recorded Feb 13, 2012
From: PANASONIC ELECTRIC WORKS CO.,LTD.,
To: PANASONIC CORPORATION
Reel/Frame 027697/0525 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2011
From: TSUJI, KOJI
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 026996/0773 →