Conductor grid for electronic housings and manufacturing method
View Patent ↗With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips ( 130, 110, 140 ) welded along the joint edge ( 150 ), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.
1. A conductor grid for electronic housings, wherein the conductor grid comprises at least one first metal strip and a second metal strip, which are connected by a continuous weld seam, the second metal strip having, at least at points, a surface suitable for wire bonding, wherein the conductor grid being in the form of a cut-out shaped part of the metal strips which are connected by the continuous weld seam.
2. A conductor grid according to claim 1 , the first metal strip is consisting of copper, iron, a copper alloy or an iron alloy.
3. A conductor grid according to claim 1 , the second metal strip consisting of copper, iron, a copper alloy or an iron alloy, and being plated, at least at points, with a metal suitable for wire bonding, preferably aluminium.
4. A conductor grid according to claim 3 , the second metal strip taking up less than half the total width of the welded metal strips.
5. A conductor grid according to claim 1 , the second metal strip consisting of a metal suitable for wire bonding, preferably of aluminium or an aluminium alloy.
6. A conductor grid according to claim 1 , the second metal strip ( 140 ) taking up more than half the total width of the welded metal strips, preferably ⅔ of the total width.
7. A conductor grid according to claim 1 , the first and the second metal strip being welded with the aid of a laser beam.
8. A conductor grid according to claim 1 , the weld seam extending along the joint edge of the first and the second metal strip.
9. A method for manufacturing a conductor grid, the conductor grid being produced from at least one first metal strip and a second metal strip, which are connected by a continuous weld seam, the second metal strip having, at least at points, a surface suitable for wire bonding, wherein the conductor grid is produced by cutting out the metal strips which are connected by the continuous weld seam.
10. A manufacturing method according to claim 9 , wherein the first metal strip consisting of copper, iron, a copper alloy or an iron alloy.
11. A manufacturing method according to claim 9 , wherein the second metal strip is consisting of copper, iron, a copper alloy or an iron alloy and being plated, at least at points, with a metal suitable for wire bonding, preferably aluminium.
12. A manufacturing method according to claim 11 , wherein the second metal strip takes up less than half the total width of the welded metal strips.
13. A manufacturing method according to claim 9 , wherein the second metal strip is consisting of a metal suitable for wire bonding, preferably of aluminium or an aluminium alloy.
14. A manufacturing method according to claim 13 , wherein the second metal strip takes up more than half the total width of the welded metal strips, preferably ⅔ of the total width.
15. A manufacturing method according to claim 9 , wherein the first and the second metal strip is welded with the aid of a laser beam.
16. A manufacturing method according to claim 9 , wherein the weld seam extends along the joint edge of the first and the second metal strip.
17. A method for manufacturing a conductor grip, comprising the steps of:
connecting a first metal strip and a second metal strip by a weld seam; and
cutting out the conductor grid from the connected first and second metal strips, wherein the second metal strip consists of at least one of copper, iron, a copper alloy, and an iron alloy with a thin strip of a metal suitable for wire bonding being plated into a recess.