Filtering nanoparticles by bonding with microparticles
View Patent ↗Disclosed are embodiments for methods and devices for filtering undesired particles from a medium by bonding the undesired particles to attachment particles. In some embodiments, the methods include receiving a plurality of attachment particles into a volume, where the volume contains a plurality of undesired particles and the medium. The method may also include contacting the plurality of attachment particles and the plurality of undesired particles contained in the medium, resulting in formation of bonded particles in the medium. Contacting may result in collisions, causing bonding between some undesired particles and some attachment particles. Some embodiments of the method also include removing at least a portion of the medium and bonded particles from the volume through a filter coupled to the volume with an exhaust, the filter configured to capture the bonded particles while allowing the medium to pass through.
1. A method for filtering particles from a medium by bonding the particles to attachment particles, the method comprising:
providing a plurality of attachment particles, and a medium suspected of containing a plurality of undesired particles, wherein the attachment particles comprise starch microparticles, cellulose microparticles, chitin microparticles, derivatives thereof, or mixtures thereof;
contacting the attachment particles, the medium, and the undesired particles such that the attachment particles and undesired particles can bond to form bonded particles; and
separating bonded particles from the medium.
2. The method of claim 1 , wherein the separating step comprises use of a fan, a pump, a vacuum, or a pressure gradient.
3. The method of claim 1 , wherein the contacting step comprises mechanical agitation of the medium or ultrasonic agitation of the medium.
4. The method of claim 1 , wherein the separating step comprises filtering the bonded particles.
5. The method of claim 1 , wherein the attachment particles have dimensions of about 1 micrometer to about 1,000 micrometers; and wherein the undesired particles have dimensions of about 0.1 nanometers to about 100 nanometers.
6. The method of claim 1 , wherein the medium is a gas, a liquid, or a mixture thereof.
7. A method for filtering particles from a medium by bonding the particles to attachment particles, the method comprising:
providing a plurality of attachment particles, and a medium suspected of containing a plurality of undesired particles, wherein the undesired particles are carbon nanoparticles, iron nanoparticles, silicon nanoparticles, or mixtures thereof;
contacting the attachment particles, the medium, and the undesired particles such that the attachment particles and undesired particles can bond to form bonded particles; and
separating bonded particles from the medium.
8. A method for filtering undesired particles from a medium by bonding the undesired particles to attachment particles, the method comprising:
receiving a medium into a volume of a collision chamber, the medium containing a plurality of undesired particles, wherein the medium is a gas or a liquid, and wherein the volume contains a plurality of attachment particles, and wherein the attachment particles comprise starch microparticles, cellulose microparticles, chitin microparticles, or mixtures thereof;
contacting the plurality of attachment particles and the plurality of undesired particles in the collision chamber to form bonded particle; and
removing the bonded particles from the collision chamber.
9. A method for filtering undesired particles from a medium by bonding the undesired particles to attachment particles, the method comprising:
receiving a medium into a volume of a collision chamber, the medium containing plurality of undesired particles, wherein the medium is a gas or a liquid, and wherein the volume contains a plurality of attachment particles, and wherein the undesired particles comprise carbon nanoparticles, iron nanoparticles, silicon nanoparticles, or mixtures thereof;
contacting the plurality of attachment particles and the plurality of undesired particles in the collision chamber to form bonded particle; and
removing the bonded particles from the collision chamber wherein the undesired particles are carbon nanoparticles, iron nanoparticles, silicon nanoparticles, or mixtures thereof.