Voltage suppressor component
View Patent ↗A voltage suppressor component including a semiconductor layer; a first port mounted on the semiconductor layer and configured to receive electrical power; a second port mounted on the semiconductor layer and configured to provide the electrical power, and a fuse in electrical series between the first port and the second port and mounted on the semiconductor layer.
1. A voltage suppressor component comprising:
a semiconductor layer;
a first port mounted on the semiconductor layer and configured to receive electrical power;
a second port mounted on the semiconductor layer and configured to provide the electrical power,
a fuse in electrical series between the first port and the second port and mounted on the semiconductor layer; and
a polymer passivation layer between the fuse and the semiconductor layer.
2. A voltage suppressor component as claimed in claim 1 , further comprising a member, connected between the first port and the second port, and configured to suppress a voltage above a predetermined threshold voltage.
3. A voltage suppressor component as claimed in claim 2 , wherein the member is a transient voltage suppressor.
4. A voltage suppressor component as claimed in claim 2 , wherein the member includes a transient voltage suppression diode, connected between the first and second ports and ground, and configured to provide an electrical path to ground for a voltage above the predetermined threshold voltage, and wherein the transient voltage suppression diode is formed in the semiconductor layer.
5. A voltage suppressor component as claimed in claim 1 , wherein the second port is configured to connect to charging control circuitry and the voltage suppressor component is configured to suppress the voltage supplied to the charging control circuitry.
6. A voltage suppressor component as claimed in claim 1 , wherein the voltage suppressor component is a discrete electronic component that is configured to be incorporated into an apparatus.
7. A voltage suppressor component as claimed in claim 1 , wherein the polymer passivation layer is positioned adjacent a bottom surface of the fuse.
8. A voltage suppressor component as claimed in claim 1 , further comprising a semiconductor passivation layer between the semiconductor layer and the polymer passivation layer.
9. An apparatus comprising a voltage suppressor component as claimed in claim 1 .
10. A mobile cellular telephone comprising a voltage suppressor component as claimed in claim 1 .
11. Packaging comprising one or more voltage suppressor components as claimed in claim 1 .
12. A method comprising:
providing a voltage suppressor component as claimed in claim 1 incorporated in an apparatus;
providing an electrical test signal to the first port;
determining whether the voltage suppressor component is electrically connected within the apparatus.
13. A method as claimed in claim 12 , further comprising electrically connecting the voltage suppressor component within the apparatus if the voltage suppressor component is not electrically connected within the apparatus.
14. A method comprising:
providing a voltage suppressor component including a semiconductor layer, a first port mounted on the semiconductor layer and configured to receive electrical power, a second port mounted on the semiconductor layer and configured to provide the electrical power,
providing a fuse in electrical series between the first port and the second port and mounted on the semiconductor layer; and
providing a polymer passivation layer between the fuse and the semiconductor layer.
15. A method as claimed in claim 14 , further comprising providing a member between the first port and the second port, wherein the member is configured to suppress a voltage above a predetermined threshold voltage.
16. A method as claimed in claim 15 , wherein the member is a transient voltage suppressor.
17. A method as claimed in claim 15 , wherein the member includes a transient voltage suppression diode, connected between the first and second ports and ground, and configured to provide an electrical path to ground for a voltage above the predetermined threshold voltage and wherein the transient voltage suppression diode is formed in the semiconductor layer.
18. A method as claimed in claim 14 , further comprising configuring the second port to connect to charging control circuitry and the voltage suppressor component is configured to suppress the voltage supplied to the charging control circuitry.
19. A method as claimed in claim 14 , wherein the polymer passivation layer is positioned adjacent a bottom surface of the fuse.
20. A method as claimed in claim 14 , further comprising providing a semiconductor passivation layer between the semiconductor layer and the polymer passivation layer.