Ultrasonic probe and ultrasonic imaging apparatus
View Patent ↗Artifacts due to lateral wave that occurs in a substrate of a Capacitive Micro-machined Ultrasonic Transducer is reduced. The substrate thickness of the ultrasonic transducer is set in an optimum range to efficiently radiate the energy of lateral wave in the sensitive band 91 of the ultrasonic transducer to the outside so that the lateral wave is attenuated thereby reducing the artifacts in ultrasonic imaging.
1. An ultrasonic probe, comprising:
a Capacitive Micro-Machined Ultrasonic Transducer,
wherein the Capacitive Micro-Machined Ultrasonic Transducer comprises:
a substrate comprising a first electrode and a lateral-wave sound velocity; and
a diaphragm having a second electrode,
wherein the diaphragm is connected at its peripheral edge to the substrate via a supporting wall which rises from the substrate, and a cavity is formed between the substrate and the diaphragm,
wherein the lateral-wave sound velocity, at least in a fractional frequency band within a sensitive band of the ultrasonic probe, is not less than a longitudinal-wave sound velocity of a medium in contact with the substrate or the diaphragm, and
wherein a coincidence frequency of the substrate with a medium in contact with the substrate or the diaphragm is present in the sensitive band.
2. The ultrasonic probe according to claim 1 , wherein the coincidence frequency of the substrate for a medium in contact with the substrate or the diaphragm is not higher than a higher cut-off frequency of the sensitive band.
3. The ultrasonic probe according to claim 1 , wherein the coincidence frequency of the substrate for a medium in contact with the substrate or the diaphragm is not lower than 1/10 of a lower cut-off frequency of the sensitive band.
4. The ultrasonic probe according to claim 1 , wherein an acoustic lens is provided on an acoustic radiation surface of the ultrasonic transducer.
5. The ultrasonic probe according to claim 4 , wherein the substrate has a thickness of not less than 3.8 μm and not more than 70 μm.
6. The ultrasonic probe according to claim 1 , wherein water or a living body is brought into contact with an acoustic radiation surface of the ultrasonic transducer when in use.
7. The ultrasonic probe according to claim 6 , wherein the substrate has a thickness of not less than 12 μm and not more than 170 μm.
8. The ultrasonic probe according to claim 1 , wherein a backing material is provided on a substrate side of the ultrasonic transducer.
9. The ultrasonic probe according to claim 1 , wherein an acoustic lens, or water or a living body is brought into contact with an acoustic radiation surface of the ultrasonic transducer, and a backing material is provided on a substrate side thereof.
10. The ultrasonic probe according to claim 8 or 9 , wherein the substrate has a thickness of not less than 12 μm and not more than 440 μm.
11. The ultrasonic probe according to claim 1 , wherein a backing material is bonded to a substrate side of the ultrasonic transducer with an adhesive.
12. The ultrasonic probe according to claim 11 , wherein the substrate has a thickness of not less than 15 μm and not more than 300 μm.
13. The ultrasonic probe according to claim 1 , wherein an electronic circuit is provided on a substrate side of the ultrasonic transducer.
14. The ultrasonic probe according to claim 13 , wherein the substrate has a thickness of not less than 15 μm and not more than 300 μm.
15. The ultrasonic probe according to claim 1 ,
wherein a thickness h of the substrate is set such that the coincidence frequency satisfies the following conditions:
c
sub
=
ω
k
sub
ω
=
2
π
f
k
sub
=
ω
α
α
2
=
Eh
2
12
ρ
sub
(
1
-
v
2
)
wherein c sub is a lateral wave velocity of plate,
wherein ω is an angular velocity,
wherein f is a frequency,
wherein k sub is a wave number of the lateral wave of the substrate,
wherein E is a Young's modulus of the substrate,
wherein h is the thickness of the substrate,
wherein ρ sub is a density of the substrate, and
wherein v is a Poisson's ratio of the substrate.