IP Library Granted Patent US 9,103,850
Granted Patent B2
US 9,103,850 · App. 13/266,985 · Granted Aug 11, 2015

Micromechanical sensor with multiple spring bars

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Quick Facts
Patent No.
US 9,103,850
App. No.
13/266,985
Granted
Aug 11, 2015
Kind
B2
Abstract

A micromechanical sensor comprising a substrate ( 5 ) and at least one mass ( 6 ) which is situated on the substrate ( 5 ) and which moves relative to the substrate ( 5 ) is used to detect motions of the sensor based on an acceleration force and/or Coriolis force which occur(s). The mass ( 6 ) and the substrate ( 5 ) and/or two masses which move toward one another are connected by at least one bending spring device ( 1 ) for a relative rotational motion. The bending spring device ( 1 ) has multiple, in particular two, spring bars ( 2 ) extending essentially parallel to one another for improving the linear spring characteristic of the bending spring device during the rotational motion, and at least one meander ( 3 ) on at least one, preferably on all, of the spring bars ( 2 ).

Claims (26)

1. A micromechanical sensor, comprising:

a substrate;

an anchor coupled to the substrate;

a bending spring device responsive to a rotational movement about the anchor, the bending spring device comprising spring bars that extend substantially parallel from the anchor to one or more masses, wherein each spring bar comprises:

a first end being coupled to the anchor; and

a second end being coupled to the one or more masses; and

a meander located between the first and the second end, wherein a total length of at least one spring bar is greater than a length of bars of the meander so as to improve a linear spring characteristic of the bending spring device.

2. The micromechanical sensor according to claim 1 , wherein the meander merges into at least one of the spring bars in a rounded manner.

3. The micromechanical sensor according to claim 1 , wherein one of the spring bars merges in a rounded manner into at least one of the masses, the substrate, and the anchor for attachment to the substrate.

4. The micromechanical sensor according to claim 3 , wherein a rounded transition associated with the rounded manner has a non-constant radius of curvature.

5. The micromechanical sensor according to claim 3 , wherein a rounded transition associated with the rounded manner is elliptical.

6. The micromechanical sensor according to claim 1 , wherein one of the spring bars merges in a branched manner into at least one of the masses, the substrate, and the anchor for attachment to the substrate.

7. The micromechanical sensor according to claim 1 , wherein at least one of the meander and the spring bars has an elliptical bend.

8. The micromechanical sensor according to claim 1 , wherein the meander is placed off-center with respect to the at least one of the spring bars, and is closer to moving components than to a stationary anchoring of the at least one bending spring.

9. The micromechanical sensor according to claim 1 , wherein a distance between bars of the meander is less than a distance between two spring bars.

10. The micromechanical sensor according to claim 1 , wherein a distance between two of the spring bars is a multiple of a width of the spring bars.

11. The micromechanical sensor according to claim 1 , wherein the bending spring device is deflected about the anchoring point in a substantially linear deflection path in response to a torque acting on the one or more masses, the bending spring device having a substantially constant spring characteristic curve.

12. The micromechanical sensor according to claim 1 , wherein both a double spring bar included in the spring bars and the meander have a symmetrical design.

13. The micromechanical sensor according to claim 1 , wherein the meander has a radius of curvature associated with an internal center of curvature inside the meander.

14. The micromechanical sensor according to claim 1 , wherein the meander has at least one further radius of curvature associated with a center of curvature outside the meander.

15. The micromechanical sensor according to claim 1 , wherein the bending spring device is coupled to both a sensor mass and a drive mass.

16. The micromechanical sensor according to claim 1 , wherein the meander is located off-center with respect to the spring bar.

17. The micromechanical sensor according to claim 1 , wherein the spring bars are substantially parallel to each other.

18. The micromechanical sensor according to claim 1 , wherein the spring bars are tapered toward each other.

19. The micromechanical sensor according to claim 1 , wherein the bars of the meander have a different length than bars of another meander.

20. The micromechanical sensor according to claim 1 , wherein the bending spring device inhibits an out-of-plane motion.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2024
From: HANKING ELECTRONICS, LTD.
To: HANKING ELECTRONICS HONGKONG CO., LIMITED
Reel/Frame 066990/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2016
From: MAXIM INTEGRATED PRODUCTS, INC.
To: HANKING ELECTRONICS, LTD.
Reel/Frame 040459/0091 →
MERGER Recorded Feb 15, 2012
From: SENSORDYNAMICS AG ENTWICKLUNGS- UND PRODUKTIONSGESELLSCHAFT
To: MAXIM INTEGRATED PRODUCTS GMBH
Reel/Frame 027713/0009 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2011
From: HAMMER, HANNO
To: SENSORDYNAMICS AG
Reel/Frame 027144/0086 →