IP Library › Patent Application 13269148
Patent Application
App. No. 13/269,148

BENDABLE CIRCUIT STRUCTURE FOR LED MOUNTING AND INTERCONNECTION

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Quick Facts
Patent No.
US None
App. No.
13/269,148
Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Claims (8)

1 - 16 . (canceled)

17 . A method of manufacturing a light emitting diode (“LED”) lighting composition, comprising:

bending a circuit structure for LED mounting to a 90° or greater angle, the circuit structure for LED mounting comprising the following layers:

(a) circuitry traces of copper or aluminum;

(b) a polyimide or adhesive layer, the metal layer being adjacent to the polymide or the adhesive layer

(c) a copper foil layer and

(d) a liquid or film solder mask layer

wherein the circuit structure for LED mounting has an increase in electrical resistance of less than 10% after bending.