Field-effect transistor, processes for producing the same, and electronic device using the same

1. A field-effect transistor which at least comprises a substrate, a semiconductor layer formed through coating process, a source electrode, and a drain electrode, wherein, in a cross-section which is parallel with a channel length direction and perpendicular to the substrate, the source electrode and/or the drain electrode has a taper shape and the taper shape forms an angle of 30° or less with the substrate.

2. The field-effect transistor according to claim 1 , wherein the semiconductor is an organic semiconductor having an annulene structure.

3. The field-effect transistor according to claim 1 , which has a variation of mobility of ±30% or less.

4. A process for producing a field-effect transistor at least comprising a substrate, a semiconductor layer, a source electrode, and a drain electrode, the process comprising; forming the source electrode and/or the drain electrode so that the source electrode and/or the drain electrode has a taper shape in a cross-section which is parallel with a channel length direction and perpendicular to the substrate; and coating a coating solution that contains a semiconductor,

wherein said taper shape forms an angle of 30° or less with the substrate.

5. A process for producing a field-effect transistor at least comprising a substrate, a semiconductor layer, a source electrode, and a drain electrode, the process comprising: forming the source electrode and/or the drain electrode so that the source electrode and/or the drain electrode has a taper shape in a cross-section which is parallel with a channel length direction and perpendicular to the substrate; coating a coating solution that contains a precursor for a semiconductor; and converting the precursor to a semiconductor by heating and/or light irradiation,

wherein said taper shape forms an angle of 30° or less with the substrate.

6. A process for producing a field-effect transistor, at least comprising a substrate, a semiconductor layer, a source electrode, and a drain electrode, the process comprising; forming the source electrode and/or the drain electrode so that the source electrode and/or the drain electrode has a taper shape in a cross-section which is parallel with a channel length direction and perpendicular to the substrate; and coating a coating solution that contains a semiconductor,

wherein said taper shape forms an angle of 30° or less with the substrate, and

wherein the source electrode and/or drain electrode which has a taper shape is formed by forming two resist layers, exposing an photoresist layer to light, removing the uncured portions, forming a metal layer, and then removing unnecessary portions of the metal layer by a lift-off method.

7. A field-effect transistor produced by the process according to claim 4 or 5 .

8. A method for improving a mobility of a field-effect transistor at least comprising a substrate, a semiconductor layer formed through coating process, a source electrode, and a drain electrode, wherein when the field-effect transistor is produced, the source electrode and/or the drain electrode is formed so that the source electrode and/or the drain electrode has a taper shape in a cross-section which is parallel with a channel length direction and perpendicular to the substrate, thereby improving the mobility,

wherein said taper shape forms an angle of 30° or less with the substrate.

9. An electronic device comprising the field-effect transistor according to claim 1 .

10. The field-effect transistor according to claim 1 , wherein said taper shape forms an angle of less than 30° with the substrate.

11. The field-effect transistor according to claim 4 , wherein said taper shape forms an angle of less than 30° with the substrate.

12. The field-effect transistor according to claim 5 , wherein said taper shape forms an angle of less than 30° with the substrate.

13. The field-effect transistor according to claim 8 , wherein said taper shape forms an angle of less than 30° with the substrate.

14. The field-effect transistor according to claim 1 , wherein a semiconductor layer formed through a coating process is formed by a method in which a coating solution comprising a precursor for a semiconductor is applied and said precursor is thereafter converted to said semiconductor.

15. The field-effect transistor according to claim 14 , wherein said precursor is converted by a reverse Diels-Alder reaction.

16. An electronic device comprising the field-effect transistor according to claim 7 .

17. A process for producing a field-effect transistor at least comprising a substrate, a semiconductor layer, a source electrode, and a drain electrode, the process comprising; forming the source electrode and/or the drain electrode so that the source electrode and/or the drain electrode has a taper shape in a cross-section which is parallel with a channel length direction and perpendicular to the substrate; and coating a coating solution that contains a semiconductor,

wherein said taper shape forms an angle of 30° or less with the substrate; and

wherein the source electrode and/or drain electrode which has a taper shape is formed by forming two resist layers, and forming a shape in which an upper photoresist layer overhangs, and forming a metal layer, and then removing unnecessary portions of said metal layer.

18. The process for forming a field-effect transistor according to claim 17 , wherein said forming a shape in which said upper photoresist layer overhangs is formed by forming a film of a photoresist on a lower resist layer which is not photosensitive, exposing said photoresist to light and then developing said layers while regulating the developing time.