Suppressing tin whisker growth in lead-free solders and platings
View Patent ↗A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
1. A process of treating a lead-free, Sn-based solder or plating comprising the steps of:
subjecting said solder or plating to an effective amount of gamma radiation so as to form an altered crystalline formation on a surface of the Sn so as to prevent the formation of whiskers.
2. The process according to claim 1 wherein said Sn-based solder or plating is on a Cu substrate.
3. The process according to claim 2 , wherein a surface of the Sn-based solder or plating has a coating of Cu oxide.
4. The process according to claim 2 , wherein the Sn-based solder or plating has a surface coating of a Rouaite.
5. The process according to claim 1 wherein said altered crystalline formation is in the form of hillock structures.
6. A process of treating Sn containing lead-free solder or plating on a copper substrate comprising the steps of exposing the Sn solder or plating to a gamma radiation source for a time interval sufficient for the formation of a Rouaite coating on a surface of the Sn, wherein said Rouaite is resistant to the formation of whiskers.
7. A process of treating a lead free, Sn-based solder or plating on a substrate comprising the steps of:
subjecting said solder or plating to an effective amount of gamma radiation so as to form a coating of metal nitrate upon a surface of the Sn solder or plating.