Methods to recover and purify silicon particles from saw kerf
View Patent ↗The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
1. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising an organic lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:
contacting the saw kerf with a chelating agent soluble in the organic lubricating fluid to form a complex with one or more metals present in the saw kerf;
mixing the chelated saw kerf solution with an aqueous acid solution and allowing the mixture to separate into an aqueous phase and an organic phase, the aqueous phase comprising silicon particles and the organic phase comprising the complex formed between chelating agent and the metals;
collecting the aqueous phase comprising the silicon particles; and,
recovering at least a portion of the silicon particles from the aqueous phase, wherein the recovered silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.
2. The method of claim 1 wherein the aqueous phase comprises the silicon particles and abrasive grains, and further wherein the aqueous phase is subjected to a density-dependent separation technique to separate the silicon particles from the abrasive grains.
3. The method of claim 2 wherein the density-dependent separation technique is selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation.
4. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising an organic lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:
contacting the saw kerf with a chelating agent soluble in the organic lubricating fluid to form a complex with one or more metals present in the saw kerf;
mixing the chelated saw kerf solution with an aqueous acid solution and allowing the mixture to separate into an aqueous phase and an organic phase, the aqueous phase comprising silicon particles and abrasive particles and the organic phase comprising the complex formed between chelating agent and the metals;
collecting the aqueous phase comprising the silicon particles and the abrasive particles;
contacting the aqueous phase comprising the silicon particles and the abrasive particles with a source of iodine, in order to convert at least a portion of the silicon present therein to SiI 4 ; and
recovering at least a portion of the silicon particles and SiI 4 from the aqueous phase by subjecting the aqueous phase to a density-dependent separation technique to thereby separate the silicon particles from the abrasive grains, wherein the density-dependent separation technique is selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation and the recovered silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.
5. The method of claim 4 wherein, prior to the density-dependent separation, the silicon particles are contacted with a liquid having a density between about 2.25 and about 3.35 gm/cm 3 to aid in the separation of silicon and abrasive grains present therein.
6. The method of claim 5 , wherein the silicon particles are contacted with an aqueous heteropolytungstate solution.
7. The method of claim 2 , wherein the collected aqueous phase is dried prior to separating the silicon particles from the abrasive grains therein.
8. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising an organic lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:
contacting the saw kerf with a chelating agent soluble in the organic lubricating fluid to form a complex with one or more metals present in the saw kerf;
mixing the chelated saw kerf solution with an aqueous acid solution and allowing the mixture to separate into an aqueous phase and an organic phase, the aqueous phase comprising silicon particles and abrasive grains and the organic phase comprising the complex formed between chelating agent and the metals;
collecting the aqueous phase comprising the silicon particles and the abrasive grains;
drying the aqueous phase to thereby yield a dried mixture comprising the silicon particles and the abrasive grains, and,
recovering at least a portion of the silicon particles from the dried mixture by subjecting the dried mixture to a non-uniform magnetic field, wherein the recovered silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.
9. The method of claim 8 , wherein the method further comprising:
creating a non-uniform magnetic field between a first pole and a second pole of the magnet;
aerosolizing the dried, solid particulate mixture; and,
feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.
10. The method of claim 1 , wherein the chelating agent is an aldoxime.
11. The method of claim 4 , wherein the chelating agent is an aldoxime.
12. The method of claim 7 , wherein the chelating agent is an aldoxime.