WAVELENGTH CONVERSION COMPONENT WITH IMPROVED THERMAL CONDUCTIVE CHARACTERISTICS FOR REMOTE WAVELENGTH CONVERSION

1 . A wavelength conversion component for a light emitting device, comprising:

a wavelength conversion layer comprising a photo-luminescent material; and

a light transmissive thermally conductive substrate in thermal contact with a surface of the wavelength conversion layer.

2 . The wavelength conversion component in claim 1 , wherein the light transmissive thermally conductive substrate is composed of sapphire.

3 . The wavelength conversion component in claim 1 , wherein the light transmissive thermally conductive substrate utilizes phononic heat conduction.

4 . The wavelength conversion component in claim 1 , wherein a rate of heat transfer between the light transmissive thermally conductive substrate and the wavelength conversion layer is increased by increasing an area of an interface between the wavelength conversion layer and the light transmissive thermally conductive substrate.

5 . The wavelength conversion component in claim 1 , wherein a rate of heat transfer between the light transmissive thermally conductive substrate and the wavelength conversion layer is increased by decreasing a thickness of the light transmissive thermally conductive substrate.

6 . The wavelength conversion component of claim 1 , wherein the wavelength conversion layer comprises a mixture of a phosphor material and a light transmissive carrier material.

7 . The wavelength conversion component in claim 1 , wherein the light transmissive thermally conductive substrate is optically transparent to wavelengths in the range of 380 nm to 740 nm.

8 . The wavelength conversion component of claim 7 , wherein the light transmissive carrier material is optically transparent to wavelengths in the range of 380 nm to 740 nm.

9 . The wavelength conversion component of claim 1 , wherein the light transmissive carrier material comprises a curable liquid polymer selected from the group consisting of: a polymer resin, a monomer resin, an acrylic, an epoxy, a silicone, and a fluorinated polymer.

10 . The wavelength conversion component of claim 1 , wherein the wavelength conversion layer is deposited onto the light transmissive thermally conductive substrate using a method selected from the group consisting of: screen printing, slot die coating, roller coating, drawdown coating and doctor blading.

11 . The wavelength conversion component of claim 1 , wherein the wavelength conversion component has a three-dimensional configuration.

12 . The wavelength conversion component of claim 1 embodied in a light emitting device that further comprises at least one solid-state light emitter operable to generate excitation light.

13 . The wavelength conversion component of claim 12 , wherein the light emitting device is selected from the group consisting of: downlights, light bulbs, linear lamps, lanterns, wall lamps, pendant lamps, chandeliers, recessed lights, track lights, accent lights, stage lighting, movie lighting, street lights, flood lights, beacon lights, security lights, traffic lights, headlamps, taillights, and signs.

14 . A light emitting device comprising:

at least one solid-state light source operable to generate light; and

a wavelength conversion component located remotely to the at least one solid-state light source and operable to convert at least a portion of the light generated by the at least one solid-state light source to light of a different wavelength, wherein the emission product of the device comprises the combined light generated by the at least one source and the wavelength conversion component; and

wherein the wavelength conversion component comprises a wavelength conversion layer comprising photo-luminescent material and a light transmissive thermally conductive substrate in thermal contact with the wavelength conversion layer.

15 . The device of claim 14 , wherein the light transmissive thermally conductive substrate comprises a sapphire material.

16 . The device of claim 14 , wherein the light transmissive thermally conductive substrate is optically transparent to wavelengths in the range of 380 nm to 740 nm.

17 . The device of claim 14 , wherein the light transmissive thermally conductive substrate utilizes phononic heat conduction.

18 . The device of claim 14 , wherein a rate of heat transfer between the light transmissive thermally conductive substrate and the wavelength conversion layer is increased by increasing an area of an interface between the wavelength conversion layer and the light transmissive thermally conductive substrate.

19 . The device of claim 14 , wherein a rate of heat transfer between the light transmissive thermally conductive substrate and the wavelength conversion layer is increased by decreasing a thickness of the light transmissive thermally conductive substrate.

20 . The device of claim 14 , wherein the wavelength conversion layer comprises a mixture of a phosphor material and a light transmissive carrier material.

21 . The device of claim 20 , wherein the light transmissive carrier material is optically transparent to wavelengths in the range of 380 nm to 740 nm.

22 . The device of claim 20 , wherein the light transmissive carrier material comprises a curable liquid polymer selected from the group consisting of: a polymer resin, a monomer resin, an acrylic, an epoxy, a silicone, and a fluorinated polymer.

23 . The device of claim 14 , wherein the wavelength conversion layer is deposited onto the light transmissive thermally conductive substrate using a method selected from the group consisting of: screen printing, slot die coating, roller coating, drawdown coating and doctor blading.

24 . The device of claim 14 , wherein the solid-state light source is configured to generate blue light.

25 . The device of claim 24 , wherein the wavelength conversion component is operable to convert at least a portion of the blue light generated by the solid-state light source to white light.

26 . The device of claim 14 , wherein the light transmissive thermally conductive substrate is further connected to a heat sink configured to thermally conduct heat away from the light transmissive thermally conductive substrate.

27 . The device of claim 26 , wherein the heat sink is also configured thermally conduct heat away from the solid-state light source.

28 . The device of claim 26 , wherein the heat sink is composed of material selected from the group consisting of: a metal, an invar alloy, aluminum, copper, a thermally conductive polymer, and a thermally conductive ceramic.

29 . The device of claim 14 , wherein the wavelength conversion component has a three-dimensional configuration.

30 . The light emitting device of claim 14 , wherein the light emitting device is selected from the group consisting of: downlights, light bulbs, linear lamps, lanterns, wall lamps, pendant lamps, chandeliers, recessed lights, track lights, accent lights, stage lighting, movie lighting, street lights, flood lights, beacon lights, security lights, traffic lights, headlamps, taillights, and signs.

31 . A linear lamp comprising:

an elongate housing;

a plurality of solid-state light emitters housed within the housing and configured along the length of the housing; and

an elongate wavelength conversion component remote to the plurality of solid-state light emitters and configured to in part at least define a light mixing chamber, wherein the elongate wavelength conversion component comprises:

an elongate wavelength conversion layer comprising a photo-luminescent material; and

an elongate light transmissive thermally conductive substrate in thermal contact with a surface of the wavelength conversion layer.

32 . A downlight comprising:

a body comprising one or more solid-state light emitters, wherein the body is configured to be positioned within a downlighting fixture such that the downlight emits light in a downward direction; and

a wavelength conversion component remote to the one or more solid-state light emitters and configured to in part at least define a light mixing chamber, wherein the wavelength conversion component comprises

a wavelength conversion layer comprising a photo-luminescent material; and

a light transmissive thermally conductive substrate in thermal contact with a surface of the wavelength conversion layer.

33 . A light bulb comprising:

a connector base configured to be inserted in a socket to form an electrical connection for the light bulb;

a body comprising one or more solid-state light emitters;

a wavelength conversion component having a three dimensional shape that is configured to enclose the one or more solid-state light emitters and to in part at least define a light mixing chamber, wherein the wavelength conversion component comprises:

a wavelength conversion layer comprising a photo-luminescent material; and

a light transmissive thermally conductive substrate in thermal contact with a surface of the wavelength conversion layer.