SOLAR CELL ARCHITECTURE HAVING A PLURALITY OF VIAS WITH SHAPED FOIL VIA INTERIOR
Methods and devices are provided for forming a low electrical resistance via filling material based on foil deformation.
1 . A solar cell comprising:
a first metal substrate supporting an absorber layer thereon, wherein the metal substrate includes a plurality of vias extending through the first metal substrate;
a second electrically conductive substrate having a plurality of protrusions on at least one surface of the second electrically conductive substrate, the protrusions positioned to extend into the vias of the first metal substrate; and
an electrically insulating layer positioned to prevent direct electrical contact between a bottom surface of the first metal substrate and an upper surface of second electrically conductive substrate.
2 . The cell of claim 1 wherein the protrusions have a cross-sectional profile with a hollow interior.
3 . The cell of claim 1 wherein the protrusions are solid.
4 . The cell of claim 1 wherein the protrusions are configured to reduce a top-side fill volume in each via.
5 . The cell of claim 1 wherein the protrusions are configured to reduce a top-side fill volume in each via by at least 50%.
6 . The cell of claim 1 wherein the protrusions are configured to reduce a top-side fill volume in each via by at least 75%.
7 . The cell of claim 1 wherein the protrusions are configured to reduce a top-side fill volume in each via by at least 90% relative to completely filling each via without a protrusion therein.
8 . The cell of claim 1 wherein the first metal substrate comprises one or more discrete layers formed over a bulk portion of the first metal substrate.
9 . The cell of claim 1 wherein the second electrically conductive substrate has at least one high electrical conductivity on exposed surfaces of protrusions extending into the vias.
10 . The cell of claim 1 wherein the second electrically conductive substrate has at least one high electrical conductivity silver-based layer on exposed surfaces of protrusions extending into the vias.
11 . The cell of claim 1 wherein the protrusions comprises multiple metals.
12 . The cell of claim 1 wherein the second electrically conductive substrate has at least one high electrical conductivity nickel-based layer on exposed surfaces of protrusions extending into the vias.
13 . The cell of claim 1 wherein the protrusions extending into the vias has a cone-like shape.
14 . The cell of claim 1 wherein the protrusions extending into the vias has a pyramid-like shape.
15 . The cell of claim 1 wherein the protrusions extending into the vias has a cylindrical shape.
16 . The cell of claim 1 wherein the protrusions wherein the second electrically conductive substrate is a metal substrate.
17 . The cell of claim 1 wherein the protrusions when inserted into the via, has an uppermost portion above an uppermost surface of first metal substrate.
18 . The cell of claim 1 wherein the protrusions when inserted into the via, has an uppermost portion below an uppermost surface of first metal substrate.
19 . A method comprising:
constructing a solar cell with a conductive pathway between two vertically separated electrode layers creating protrusion in electrode material in at least one of the layers to extend through vias in the other electrode layer.
20 . The method of claim 19 wherein creating the protrusions in the electrode material comprises using a punch to deform the electrode material.
21 - 32 . (canceled)