Integral heater assembly and method for carrier or host board of electronic package assembly

1. A printed circuit carrier board of a surface mount module, configured for soldering onto a larger host board, comprising:

one or more upper layers, at least one upper layer carrying surface mound electronic components;

a lower, solder interface layer comprising a metallized mounting plane configured for soldering on a host board;

a heater layer embedded in the board between the upper and lower layers, the heater layer being closer to the lower layer than the upper layer;

a first dielectric layer between the heater layer and solder interface layer;

a second dielectric layer between the heater layer and said one or more upper layers;

the heater layer having at least one elongated heater element of copper material, the heater element extending in a circuitous path across the entire area of the heater layer;

a pair of inputs connected to the heater element and configured for connection to a high current, low voltage power supply; and

the first dielectric layer being thinner than the second dielectric layer, whereby heat from the heater element is transferred through the first dielectric layer to the solder interface layer faster than through the second dielectric layer to the upper layers and the solder layer is heated to a solder reflow temperature before the one or more upper layers.

2. The carrier board of claim 1 , wherein the first dielectric layer has a thickness in the range from about 0.003 inches to about 0.006 inches.

3. The carrier board of claim 1 , wherein the copper heater element comprises a single, continuous copper trace having a length of at least thirty inches.

4. The carrier board of claim 3 , wherein the copper heater element is configured to produce power of at least approximately 10 watts when connected to a three amp power supply.

5. The carrier board of claim 3 , wherein the copper trace has a thickness of ¼ oz to ½ oz.

6. The carrier board of claim 5 , wherein the copper trace has a width in the range from about 0.004 to about 0.005 inches.

7. The carrier board of claim 1 , further comprising ground connection points configured for selective connection of the heater element to ground when not in use.

8. A method of removing a selected surface mount module from a host board of an electronics package assembly, comprising:

energizing an elongate, copper trace heater element which is arranged in a circuitous path across at least part of the area of a heater layer embedded in the carrier board of a selected surface mount module, the heater layer being located in a lower portion of the carrier board at a predetermined first distance from a lower solder interface layer of the carrier board and a predetermined second distance from upper layers of the carrier board on which electronic components are surface mounted, the first distance being less than the second distance whereby the heater layer is closer to the solder interface layer than the surface mounted electronic components, the solder interface layer being soldered to the host board of an electronics package assembly;

the step of energizing the heater element comprising connecting the element to a high current, low voltage power supply of at least three amps, whereby the power output of the heater element is at least ten watts;

heating the lower solder interface layer of the surface mount module with the heater element to the reflow temperature of the solder material forming the solder interface layer, the one or more upper layers being at a lower temperature than the solder reflow temperature due to the larger distance of the one or more upper layers from the heater element;

removing the surface mount module from the host board before the one or more upper layers reach the solder reflow temperature; and

disconnecting the heater element from the power supply.

9. The method of claim 8 , further comprising heating the entire electronics package assembly in an oven from ambient temperature to a first temperature lower than the solder reflow temperature prior to energizing the heater element embedded in the selected surface mount module to heat the lower solder interface layer of the surface mount module from the first temperature to the reflow temperature.

10. The method of claim 9 , wherein the first temperature is approximately 20 degrees less than the solder reflow temperature.

11. The method of claim 8 , further comprising connecting the heater element to a ground plane when not in use.

12. A surface mount technology (SMT) module, comprising:

a printed circuit board (PCB) having multiple PCB layers including one or more upper layers and a lower, solder interface layer;

a plurality of surface mounted electronic components carried by the one or more upper layers;

the solder interface layer comprising a metallized mounting plane configured for soldering on a larger host board;

a heater layer embedded in the PCB between the solder interface layer and the one or more upper layers, the heater layer being closer to the lower, solder interface layer than the one or more upper layers carrying surface mounted electronic components;

a first dielectric layer between the heater layer and solder interface layer;

a second dielectric layer between the heater layer and said one or more upper layers;

the heater layer having a single elongated heater element of copper material, the heater element extending in a continuous circuitous path across the entire area of the heater layer; and

a pair of inputs connected to the heater elements and configured for connection to a high current, low voltage power supply.