Heat transfer label for decorating a metal container
View Patent ↗A heat transfer label assembly includes a heat transfer label including ink and adhesive, and a releasable support joined to the heat transfer label. The adhesive may include at least one of a polyketone resin and a polyamide resin. The heat transfer label may be used to decorate a metal article.
1. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyketone resin has a softening temperature of from about 90° C. to about 140° C.; and
a releasable support portion joined to the heat transfer label portion.
2. The heat transfer label assembly of claim 1 , wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin.
3. The heat transfer label assembly of claim 1 , wherein the polyamide resin has a softening temperature of from about 100° C. to about 150° C.
4. The heat transfer label assembly of claim 1 , wherein the polyamide resin has a softening temperature of from about 160° C. to about 215° C.
5. The heat transfer label assembly of claim 1 , wherein the polyamide resin comprises a first polyamide resin and a second polyamide resin.
6. The heat transfer label assembly of claim 5 , wherein the first polyamide resin has a softening temperature of from about 100° C. to about 150° C. and the second polyamide resin has a softening temperature of from about 160° C. to about 215° C.
7. The heat transfer label assembly of claim 5 , wherein the ratio of the first polyamide resin to the second polyamide resin is from about 3:1 to about 15:1.
8. The heat transfer label assembly of claim 1 , wherein the releasable support portion comprises a release layer and a carrier.
9. The heat transfer label assembly of claim 8 , wherein the release layer comprises wax, and optionally, at least one of a polymer and a slip additive.
10. The heat transfer label assembly of claim 9 , wherein the slip additive comprises a siloxane.
11. The heat transfer label assembly of claim 1 , wherein the heat transfer label portion is for being adhered to a metal article.
12. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin,
wherein
the polyketone resin has a softening temperature of from about 90° C. to about 140° C., and
the polyamide resin has a softening temperature of from about 100° C. to about 150° C.; and
a releasable support portion joined to the heat transfer label portion, wherein the releasable support portion comprises a release layer and a carrier, wherein the releasable support portion is configured so that the release layer is positioned between the heat transfer label portion and the carrier.
13. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin,
wherein
the polyketone resin has a softening temperature of from about 90° C. to about 140° C., and
the polyamide resin has a softening temperature of from about 160° C. to about 215° C.; and
a releasable support portion joined to the heat transfer label portion, wherein the releasable support portion comprises a release layer and a carrier, wherein the releasable support portion is configured so that the release layer is positioned between the heat transfer label portion and the carrier.
14. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin; and
a releasable support portion joined to the heat transfer label portion,
wherein the polyamide resin comprises a first polyamide resin and a second polyamide resin, wherein the first polyamide resin has a softening temperature of from about 100° C. to about 150° C., and the second polyamide resin has a softening temperature of from about 160° C. to about 215° C.
15. The heat transfer label assembly of claim 14 , wherein the ratio of the first polyamide resin to the second polyamide resin is from about 3:1 to about 15:1.
16. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyamide resin has a softening temperature of from about 100° C. to about 150° C.; and
a releasable support portion joined to the heat transfer label portion.
17. The heat transfer label assembly of claim 16 , wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin.
18. The heat transfer label assembly of claim 16 , wherein the polyketone resin has a softening temperature of from about 90° C. to about 140° C.
19. The heat transfer label assembly of claim 16 , wherein
the polyamide resin comprises a first polyamide resin, and
the adhesive comprises a second polyamide resin.
20. The heat transfer label assembly of claim 19 , wherein the second polyamide resin has a softening temperature of from about 160° C. to about 215° C.
21. The heat transfer label assembly of claim 20 , wherein the ratio of the first polyamide resin to the second polyamide resin is from about 3:1 to about 15:1.
22. The heat transfer label assembly of claim 16 , wherein the releasable support portion comprises a release layer and a carrier, wherein the release layer comprises wax, and optionally, a slip additive.
23. The heat transfer label assembly of claim 22 , wherein the slip additive comprises a siloxane.
24. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin and a polyamide resin, wherein the polyamide resin has a softening temperature of from about 160° C. to about 215° C.; and
a releasable support portion joined to the heat transfer label portion.
25. The heat transfer label assembly of claim 24 , wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin and about 65 to about 95 wt % polyamide resin.
26. The heat transfer label assembly of claim 24 , wherein the polyketone resin has a softening temperature of from about 90° C. to about 140° C.
27. The heat transfer label assembly of claim 24 , wherein
the polyamide resin comprises a first polyamide resin, and
the adhesive comprises a second polyamide resin.
28. The heat transfer label assembly of claim 27 , wherein the second polyamide resin has a softening temperature of from about 100° C. to about 150° C.
29. The heat transfer label assembly of claim 28 , wherein the ratio of the first polyamide resin to the second polyamide resin is from about 3:1 to about 15:1.
30. The heat transfer label assembly of claim 24 , wherein the releasable support portion comprises a wax, and optionally, a slip additive.
31. The heat transfer label assembly of claim 30 , wherein the slip additive comprises a siloxane.
32. A heat transfer label assembly, comprising:
a heat transfer label portion including ink and an adhesive, wherein the adhesive comprises a polyketone resin, a first polyamide resin, and a second polyamide resin; and
a releasable support portion joined to the heat transfer label portion.
33. The heat transfer label assembly of claim 32 , wherein the first polyamide resin has a softening temperature of from about 100° C. to about 150° C. and the second polyamide resin has a softening temperature of from about 160° C. to about 215° C.
34. The heat transfer label assembly of claim 32 , wherein the ratio of the first polyamide resin to the second polyamide resin is from about 3:1 to about 15:1.
35. The heat transfer label assembly of claim 32 , wherein the adhesive comprises from about 5 to about 35 wt % polyketone resin.
36. The heat transfer label assembly of claim 32 , wherein the polyketone resin has a softening temperature of from about 90° C. to about 140° C.
37. The heat transfer label assembly of claim 32 , wherein the releasable support portion comprises wax, and optionally, a slip additive.
38. The heat transfer label assembly of claim 37 , wherein the slip additive comprises a siloxane.